EM68D16CBQC-18IH

Memory IC Overview

The EM68D16CBQC-18IH is a 2Gb DDR2 SDRAM component designed for automotive applications. It features a density of 2Gb organized as 128M x 16 and utilizes an 84-ball FBGA package with JEDEC standard pin compatibility. The device operates at a typical voltage of 1.8V and incorporates On-Die Termination (ODT) to reduce signal reflection and power consumption. It supports Grade 3 temperature range (-40°C to +85°C) and Grade 2 temperature range (-40°C to +105°C). The chip has passed AEC-Q100 stress testing, including ELFR, HTOL, and MSL certifications, ensuring stability under vibration, humidity, and thermal shock.

Memory IC Feature Summary

• Automotive-grade reliability certified by AEC-Q100 stress tests including ELFR, HTOL, and MSL.
• DDR2 architecture with On-Die Termination (ODT) for improved signal integrity and lower power consumption.
• Compact 84-ball FBGA package compatible with JEDEC standards for easy hardware upgrades.
• Dual temperature grade options covering -40°C to +85°C and -40°C to +105°C.

Memory IC Applications

• In-vehicle infotainment hosts for audio streaming and navigation data caching.
• Digital instrument clusters for graphic frame buffering and high-resolution rendering.
• ADAS front-facing cameras for image preprocessing algorithm data pooling.
• Automotive hard disk and DVD buffers for read/write smoothing.

Memory IC Procurement Notes

Verify the specific suffix 'IH' against official Etron documentation to confirm the exact temperature grade and packaging details, as suffixes often denote critical environmental or physical variations. Ensure the source document explicitly links this suffix to the intended application environment. Cross-reference the part number with authorized distributors to confirm current availability and authenticity, avoiding unauthorized third-party sources that may not provide valid traceability for automotive-grade components.

Memory IC Selection Notes

Select this component when designing systems requiring high bandwidth and low power consumption within automotive environments. The DDR2 architecture offers higher data throughput compared to first-generation DDR at similar core frequencies. Consider the available temperature grades based on the installation location; Grade 2 is suitable for areas near the engine bay or direct sunlight, while Grade 3 fits cabin entertainment systems. The compact FBGA package aids in saving PCB space for multi-camera fusion systems.

Memory IC Part Context

This DRAM chip addresses the increasing demands of vehicle intelligence and connectivity. As ADAS and digital dashboards require greater memory bandwidth and long-term supply stability, this solution provides a high-integration storage option. It is engineered to handle the rigorous conditions of modern automotive electronics, balancing performance with robustness.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided reference material. Verify compatibility with existing motherboard designs due to the JEDEC pin-compatible nature of the 84-ball FBGA package before considering alternative sourcing.