EM6GA16LBXA-12H

$1.95

Description：IC DRAM 256MBIT 96FBGA
Series：-
Mfr：Etron Technology, Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:2201e4420510 Category: Memory IC Brand: Etron Technology, Inc.

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Product introduction

EM6GA16LBXA-12H is listed in the Memory IC range at ChipApex. The manufacturer field lists Etron Technology, Inc.. Its product description is IC DRAM 256MBIT 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM6GA16LBXA-12H

Description：IC DRAM 256MBIT 96FBGA
Series：-
Mfr：Etron Technology, Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
Memory Type：-
Memory Format：DRAM
Technology：-
Memory Size：256Mbit
Memory Organization：-
Memory Interface：-
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for EM6GA16LBXA-12H

EM6GA16LBXA-12H

Memory IC Overview

The Etron Technology EM6GA16LBXA-12H is a 256Mb RPC DRAM featuring an x16 interface. It operates at a clock frequency of 800MHz with a maximum data rate of 1600 MTPS/pin. The device utilizes a single power supply configuration where VDD1, VDD, and VDDQ are all set to 1.5V (range 1.425V~1.575V). It is housed in a 96-ball FBGA package measuring 9 x 13 x 1.2mm. The component supports an extended low-temperature operating range from -20°C to +85°C.

Memory IC Feature Summary

Supports parallel or serial terminated signaling via mode-register selectable on-chip resistors for point-to-point operation.
Merges address, command, and data onto a common bus to reduce pin count while maintaining DDR3-level bandwidth.
Features a low-power physical layer architecture that eliminates the need for PLLs or DLLs.
Includes four internal banks supporting bank interleave and pipelined page activations.

Memory IC Applications

Video buffer memory systems requiring high bandwidth.
Monitor timing control (T-con) circuits.
Panel self-refresh (PSR) implementations.
IoT wearable devices with space constraints.
Multichip modules and stacked die configurations.

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet revision to confirm package type and temperature grade. Ensure compatibility with the system's power supply voltage requirements, specifically the 1.5V nominal specification. Confirm signal integrity requirements for the differential clock and data strobe interfaces before integration.

Memory IC Selection Notes

Select this component when minimizing IO pin count is critical for controller ASIC design or multichip packaging. It is suitable for applications demanding high transaction efficiency without the complexity of traditional parallel DDR3 interfaces. Consider the available packaging options, including Known Good Die, if board space is severely limited.

Memory IC Part Context

This part belongs to the EM6GA16L series of High Bandwidth RPC DRAMs. The 'BX' designation indicates the 96-ball FBGA package variant. The 'E' suffix denotes the extended low-temperature grade (-20°C to +85°C), distinguishing it from commercial temperature variants within the same product family.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: EM6GA16LGDA-12E (Known Good Die), EM6GA16LCAEA-12EH (WLCSP Package). Verify electrical parameters and package dimensions match the target application requirements.

Memory IC FAQ

How does the RPC DRAM reduce pin count compared to standard DDR3?

It merges address, command, and data onto a common bidirectional bus and uses a single STB pin for serial command transmission, reducing switching signals to 22 or 24.