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EM6GA16LCAEA-12H is listed in the Memory IC range at ChipApex. The manufacturer field lists Etron Technology, Inc.. Its product description is IC DRAM 256MBIT PAR 50WLCSP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for EM6GA16LCAEA-12H
- Description：IC DRAM 256MBIT PAR 50WLCSP
- Series：-
- Mfr：Etron Technology, Inc.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：DRAM-RPC
- Memory Size：256Mbit
- Memory Organization：16M x 16
- Memory Interface：Parallel
- Clock Frequency：800 MHz
- Write Cycle Time - Word, Page：15ns
- Voltage - Supply：1.425V ~ 1.575V
- Operating Temperature：0°C ~ 85°C (TC)
- Mounting Type：Surface Mount
- Package / Case：50-UFBGA, WLCSP
- Supplier Device Package：50-WLCSP (1.96x4.63)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for EM6GA16LCAEA-12H
Memory IC Overview
The EM6GA16LCAEA-12H is a 256Mbit DRAM-RPC memory IC manufactured by Etron Technology, Inc. It utilizes the Rambus Protocol Compatible (RPC) architecture and operates at a frequency of 800 MHz with a 6 ns access time. The component features a parallel interface and is housed in a 50-WLCSP package measuring 1.96x4.63 mm.
Memory IC Feature Summary
- Implements Etron's proprietary RPC-DRAM architecture for high-speed data transfer
- Provides parallel interface connectivity for system integration
- Utilizes Wafer Level Chip Scale Packaging for compact form factor
Memory IC Applications
- Mobile communication devices requiring high bandwidth memory
- Portable consumer electronics with space constraints
- Embedded systems utilizing RPC protocol standards
Memory IC Procurement Notes
Verify the specific suffix 'CAE' confirms the 50-WLCSP package type as distinct from FBGA or Known Good Die variants. Ensure compatibility with host controllers supporting the 800 MHz RPC interface. Confirm voltage specifications against system requirements prior to integration.
Memory IC Selection Notes
Select this component when a 256Mbit capacity is required within a minimal footprint. The WLCSP package suits applications where board real estate is limited. Verify that the design supports the specific RPC signaling requirements and thermal characteristics associated with this density and package style.
Memory IC Part Context
This part belongs to Etron's EM6GA series of RPC-DRAM products. The series addresses emerging markets demanding high bandwidth and low power consumption. The CAE suffix specifically denotes the Wafer Level Chip Scale Package configuration, differentiating it from other packaging options like FBGA.
Memory IC Replacement Considerations
Direct substitutes include other EM6GA16LCAEA variants with compatible speed grades. Cross-package replacements such as the EM6GA16LBXA-12H offer identical electrical performance but require PCB layout adjustments due to the FBGA package difference.
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