EM6GC16EWKG-10H

Memory IC Overview

The EM6GC16EWKG-10H is a SDRAM component manufactured by Etron Technology, Inc. It utilizes DDR3 technology and offers a storage capacity of 4Gb organized as 512M x 8 bits. The device features a parallel interface with a clock frequency of 933 MHz and an access time of 20 ns. It operates within a voltage range of 1.425V to 1.575V and supports a write cycle time of 15 ns. The memory is housed in a 78-TFBGA package measuring 7.5x10.6 mm. It functions reliably across a temperature range of -40°C to 95°C (TC) and holds MSL rating 3.

Memory IC Feature Summary

• Supports high-speed data transfer via parallel interface architecture
• Operates on low-voltage power supply specifications for energy efficiency
• Designed for industrial-grade reliability across wide temperature ranges

Memory IC Applications

• Multimedia systems requiring rapid data handling
• Industrial electronic equipment
• Portable electronics integration

Memory IC Procurement Notes

Verify the exact suffix against official Etron Technology documentation to confirm specific speed grades or packaging variations. Ensure compatibility with system voltage requirements of 1.425V to 1.575V. Confirm that the 78-TFBGA footprint matches the target PCB design. Check for RoHS3 compliance status if required by regional regulations. Validate moisture sensitivity level handling procedures during assembly.

Memory IC Selection Notes

Select this component when a parallel DDR3 SDRAM solution is required for space-constrained designs. The 78-TFBGA package offers a compact form factor suitable for portable applications. Consider the industrial temperature range if the deployment environment experiences significant thermal fluctuations. Ensure the host controller supports the specified 933 MHz clock frequency for optimal performance.

Memory IC Part Context

This part belongs to the EM6GE08 series of DRAM components from Etron Technology. It serves as a volatile memory solution for embedded systems. The series is characterized by its use of surface mount technology and robust construction. It is commonly integrated into circuit boards alongside SoCs like the Amlogic A113X for multimedia processing tasks.

Memory IC Replacement Considerations

Cross-reference with other Etron DDR3 parts in the same package family. Verify pin-to-pin compatibility before substituting. Ensure electrical parameters match the original design requirements.