Memory IC EM6GE08EW9G-10IH product image

EM6GE08EW9G-10IH

$6.46
  • Description:IC DRAM 4GBIT PARALLEL 78FBGA
  • Series:-
  • Mfr:Etron Technology, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:45ad533a9ad3 Category: Brand:

  
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EM6GE08EW9G-10IH is listed in the Memory IC range at ChipApex. The manufacturer field lists Etron Technology, Inc.. Its product description is IC DRAM 4GBIT PARALLEL 78FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EM6GE08EW9G-10IH

  • Description:IC DRAM 4GBIT PARALLEL 78FBGA
  • Series:-
  • Mfr:Etron Technology, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:4Gbit
  • Memory Organization:512M x 8
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-FBGA (7.5x10.6)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EM6GE08EW9G-10IH

EM6GE08EW9G-10IH

Memory IC Overview

The EM6GE08EW9G-10IH is a 4Gb parallel SDRAM component manufactured by Etron Technology, Inc. It operates as DDR3 memory with a clock frequency of 933 MHz and an access time of 20 ns. The device features a write cycle time of 15 ns and functions within a supply voltage range of 1.425V to 1.575V. It is housed in a 78-TFBGA package measuring 7.5x10.6 mm. The memory organization is 512M x 8, and it supports an industrial operating temperature range from -40°C to 95°C (TC).

Memory IC Feature Summary

  • Supports high-speed data transfer via parallel interface at 933 MHz.
  • Designed for industrial environments with extended temperature tolerance.
  • Utilizes compact surface-mount packaging for efficient board integration.

Memory IC Applications

  • Industrial control systems requiring reliable volatile memory storage.
  • Automotive electronics operating under wide temperature conditions.
  • High-performance embedded computing platforms utilizing DDR3 architecture.

Memory IC Procurement Notes

Verify the specific suffix 'W9G' against official Etron Technology documentation to confirm pinout and electrical characteristics match your design requirements. Ensure that the 78-FBGA footprint dimensions align precisely with your PCB layout constraints. Confirm RoHS3 compliance status through the manufacturer's current environmental statement before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 4Gb capacity with parallel DDR3 interface is required for industrial-grade applications. Consider the 78-TFBGA package size for space-constrained designs. Verify that the system power supply can maintain the specified 1.425V to 1.575V range reliably. Ensure thermal management strategies accommodate the 95°C maximum junction temperature limit during operation.

Memory IC Part Context

This part belongs to the EM6GE08 series of DDR3 SDRAM devices from Etron Technology. It is designed to provide high-density memory solutions for demanding electronic applications. The component integrates advanced manufacturing processes to ensure reliability and performance consistency across varying environmental conditions.

Memory IC Replacement Considerations

Consult official Etron Technology substitution guides for verified alternatives. Cross-reference pin compatibility and electrical specifications with potential replacement parts to ensure seamless integration without redesigning the host system.

EM6GE08EW9G-10IHEM6GE08EW9G-10IH
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