EMC1501-1-AC3-TR

Thermal Management Overview

The EMC1501-1-AC3-TR is a Memory Module Temperature Sensor and Serial Presence Detect EEPROM manufactured by Microchip Technology. It integrates an internal temperature monitor with a 2k bit (256 byte) EEPROM, compliant with the JEDEC TSE2002av specification. The device supports three voltage ranges: 1.8V, 2.5V, or 3.3V. It provides 1°C accuracy from 25°C to 100°C and features programmable high, low, and critical temperature limits. The component utilizes an SMBus 2.0 and I2C compliant two-wire interface.

Thermal Management Feature Summary

• Integrated 2k bit EEPROM with permanent and temporary software locks for data protection
• Internal temperature monitor providing 1°C accuracy within the 25°C to 100°C range
• Configurable EVENT pin operating as an interrupt or comparator output
• Supports SMBus 2.0 and I2C protocols including Page Read and Write operations

Thermal Management Applications

• Dual In-line Memory Modules (DIMMs)
• Desktop and Mobile Computers
• Telecom equipment

Thermal Management Procurement Notes

Verify the specific ordering suffix AC3 corresponds to the 8-pin TDFN 2mm x 3mm package and RoHS compliance status. Confirm that the TR designation indicates tape and reel packaging containing 5,000 pieces per reel. Ensure the procurement documentation matches the manufacturer part number exactly to avoid compatibility issues with SPD implementations.

Thermal Management Selection Notes

Select this component when designing memory modules requiring integrated thermal monitoring alongside standard SPD storage. The device is suitable for systems needing precise temperature tracking within the specified operational range. Consider the available software protection mechanisms if write security for the EEPROM data is a priority in the system architecture.

Thermal Management Part Context

This part belongs to the EMC1501 family of memory module sensors. It serves as a specialized solution for JEDEC-compliant Serial Presence Detect applications. The integration of temperature sensing with non-volatile memory reduces the component count required on memory boards compared to using separate devices.

Thermal Management Replacement Considerations

Public confirmed substitute part numbers are not available in the provided datasheet.