Memory IC EMD3D256M08G1-150CBS1 product image

EMD3D256M08G1-150CBS1

$49.27
  • Description:IC RAM 256MBIT PAR 78BGA
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray

SKU:6054977af285 Category: Brand:

  
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EMD3D256M08G1-150CBS1 is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 256MBIT PAR 78BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for EMD3D256M08G1-150CBS1

  • Description:IC RAM 256MBIT PAR 78BGA
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:Parallel
  • Clock Frequency:667 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-BGA (10x13)
  • Access Time:14 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for EMD3D256M08G1-150CBS1

EMD3D256M08G1-150CBS1

Memory IC Overview

The EMD3D256M08G1-150CBS1 is a 256Mb (32Mb x 8) DDR3 Spin-transfer Torque MRAM. It operates at VDD = 1.5V ±0.075V with speeds up to 667MHz fCK (1333MT/sec/pin). The device features an 8n prefetch architecture, on-device termination, and internal ZQ calibration. It uses a 78-ball BGA package and supports standard DDR3 SDRAM features including burst lengths of 8 or chopped 4.

Memory IC Feature Summary

  • Non-volatile memory retaining data without power
  • High endurance write cycle capability
  • DDR3 compatible interface with on-die termination
  • No cell refresh required

Memory IC Applications

  • Embedded systems requiring non-volatile storage
  • Industrial control applications
  • Telecommunications infrastructure
  • Smart city devices

Memory IC Procurement Notes

Verify the specific suffix 'G1' against official datasheets as it may indicate a specific speed bin or configuration not explicitly detailed in the base model description. Confirm RoHS compliance status through manufacturer documentation. Ensure the 78-ball BGA footprint matches your PCB design requirements. Check for any obsolescence notices from Everspin Technologies.

Memory IC Selection Notes

Select this component when non-volatility and high-speed DDR3 performance are required. It is suitable for designs needing high write endurance compared to traditional flash. Ensure the system can support the 1.5V supply voltage and differential clock signals. Consider the thermal characteristics of the 78-ball BGA package for heat dissipation.

Memory IC Part Context

This part belongs to the EMD3D256MxxBS1 series of DDR3 STT-MRAMs. It is designed to be fully compatible with JEDEC JESD79-3F DDR3 standards, offering improvements in non-volatility and endurance. The series includes both x8 and x16 configurations, with this specific model being the 32Mb x 8 variant.

Memory IC Replacement Considerations

Direct replacements must match the 256Mb density, DDR3 interface, and 78-ball BGA package. Verify timing parameters such as tRCD and tRP as they differ from standard DRAM. Consult Everspin for alternative part numbers within the same family if exact suffixes are unavailable.

EMD3D256M08G1-150CBS1EMD3D256M08G1-150CBS1
$49.27
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