EMIF02-MIC03F2

Overview

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in systems subjected to electromagnetic interferences. It functions as a 2-line symmetrical low-pass filter with integrated ESD protection circuitry. The component offers high efficiency in EMI filtering, providing S21 attenuation of -40 dB at 900 MHz and crosstalk suppression of -60 dB in the audio band. It includes ESD protection compliant with IEC 61000-4-2 Level 4 standards, handling ±15 kV air discharge and ±8 kV contact discharge. Packaged in a lead-free Flip Chip WLCSP format, it measures 0.89 x 1.26 mm with a thickness of 0.6 mm after reflow.

Feature Summary

• Integrated 2-channel symmetrical low-pass filter for high-efficiency EMI suppression
• Built-in ESD protection circuitry preventing damage from electrostatic surges
• Ultra-compact wafer-level packaging minimizing PCB space consumption
• Monolithic integration reducing parasitic elements for high reliability

Applications

• Mobile phones and communication systems requiring EMI filtering
• Portable devices needing compact ESD and noise protection
• Computers, printers, and MCU boards with EMI-sensitive interfaces

Procurement Notes

Verify current availability status as this part may be obsolete or discontinued. Confirm package type and pinout compatibility during integration. Ensure design reviews account for the specific thermal and mechanical requirements of the flip-chip wafer-level packaging. Check for updated replacement components if supply chain continuity is required.

Selection Notes

Select this component for applications requiring simultaneous EMI filtering and ESD protection in limited space. The symmetrical low-pass characteristic suits differential or parallel signal lines. Consider the 0.6 mm profile for thin form-factor designs. Verify that the IEC 61000-4-2 Level 4 rating meets the target system's environmental stress requirements.

Part Context

This device belongs to STMicroelectronics' EMIF02 family of integrated EMI filters. It utilizes IPAD technology for wafer-level packaging, where the package size equals the die size. This approach minimizes parasitic effects compared to traditional packages. The family targets high-speed data lines and interface ports in consumer electronics.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. The datasheet indicates the product lifecycle status as Obsolete. Designers should consult manufacturer archives for direct replacements or evaluate newer generations within the EMIF series.