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The EMIF02-USB02F2 is a highly integrated array designed to suppress EMI and RFI noise for USB port filtering. It features a flip-chip package with dimensions of 1.5 x 1.5 mm and a thickness of 0.65 mm. The device provides two-channel low-pass filtering combined with two-line electrostatic discharge (ESD) protection, ensuring signal integrity in high-speed data interfaces while maintaining a compact form factor suitable for space-constrained mobile applications.
Verify the specific suffix F2 against the manufacturer's current datasheet to confirm pinout and electrical characteristics. Ensure compatibility with existing PCB layout constraints regarding the flip-chip package dimensions. Cross-reference with official STMicroelectronics documentation to validate RoHS compliance and operating temperature ranges before finalizing procurement decisions.
Select this component when space constraints require a low-profile solution for USB interface protection. The flip-chip format offers advantages over traditional packages by reducing board area usage. Consider the dual functionality of filtering and ESD protection as a single point of integration to simplify bill of materials and assembly processes for portable electronic designs.
This part belongs to the EMIF02 series from STMicroelectronics, which focuses on electromagnetic interference mitigation. The series includes variants tailored for different interfaces such as USB and audio lines. The EMIF02-USB02F2 specifically targets USB ports, providing a specialized solution within the broader portfolio of passive filtering components designed for modern digital communication standards.
Check for direct substitutes like the EMIF02-USB01F2 or EMIF02-USB03F2 if pinouts differ. Verify that alternative parts maintain the same 0.65 mm thickness and 1.5 x 1.5 mm footprint to ensure mechanical compatibility without redesigning the PCB.