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The EMIF03-SIM01F2 is a System-in-Package (SiP) EMI filter and ESD protection device by STMicroelectronics. It integrates three RC low-pass filters with an ESD protection array for SIM card interfaces. Key parameters include a maximum reverse standby voltage of 3V, a minimum breakdown voltage of 6V, and a maximum reverse leakage current of 100nA at 1mA test current. The component features 15 pins in a flip-chip wafer level package measuring 1.58 x 1.58mm. It operates within a temperature range of -30°C to +85°C.
Verify the specific datasheet revision and ordering suffixes to ensure compatibility with target PCB footprints. Confirm that the flip-chip package dimensions align with assembly requirements. Check for any regional compliance certifications required for the intended market. Ensure storage conditions meet the manufacturer's specifications for moisture sensitivity levels prior to soldering.
Select this component when designing circuits requiring integrated EMI filtering and ESD protection for SIM interfaces. The SiP architecture reduces board space compared to discrete solutions. Consider the 3V standby voltage limit when interfacing with power rails. Verify thermal performance within the specified operating temperature range for the application environment.
This part belongs to the EMIF series of integrated EMI filters and ESD protectors from STMicroelectronics. These devices are designed to replace multiple discrete components, simplifying circuit design. The series targets high-density applications where signal integrity and component protection are critical. The EMIF03 variant specifically addresses multi-line interface requirements.
Public confirmed substitute part numbers are not available in the provided documentation. Consult official distributor catalogs or manufacturer cross-reference tools for compatible alternatives.