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Product Detailed Parameters
- Description：FILTER ESD SMD
- Series：EMIF
- Mfr：STMicroelectronics
- Package：Tape & Reel (TR)
- Type：Low Pass
- Filter Order：-
- Technology：-
- Number of Channels：5
- Center / Cutoff Frequency：-
- Attenuation Value：-
- Resistance - Channel (Ohms)：-
- Values：-
- ESD Protection：Yes
- Operating Temperature：-40°C ~ 85°C
- Applications：Data Lines for Mobile Devices
- Voltage - Rated：-
- Mounting Type：Surface Mount
- Package / Case：12-UFBGA, FCBGA
- Size / Dimension：0.062" L x 0.046" W (1.57mm x 1.17mm)
- Height：0.022" (0.55mm)
- Current：-
- Grade：-
- Qualification：-
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Overview
The EMIF05-AUD02F3 is an EMI filter and ESD protection device manufactured by STMicroelectronics. It features a complex array configuration with six individual chip elements per package. The component supports surface mount installation using a flip-chip BGA (FCBGA) package type, specifically identified as 12-UFBGA. Key electrical parameters include a minimum breakdown voltage of 6V and a maximum reverse standby voltage of 3V. The device operates within a temperature range of -40°C to +85°C and has a physical footprint of 1.57mm x 1.17mm.
Feature Summary
- Integrated EMI filtering and electrostatic discharge protection for data lines
- Compact ultra-thin flat package design suitable for space-constrained mobile applications
- Multi-channel architecture providing simultaneous protection for multiple signal paths
Applications
- Data line protection in mobile devices
- Audio interface circuitry shielding
- Portable electronic equipment signal integrity maintenance
Procurement Notes
Verify the current lifecycle status before procurement, as public records indicate this specific part number may be obsolete or subject to product termination notifications. Confirm that the 12-UFBGA package dimensions and pinout match the target PCB layout requirements. Ensure compatibility with existing assembly processes for flip-chip BGA components.
Selection Notes
Select this component when designing circuits requiring combined low-pass filtering and transient voltage suppression for audio or high-speed data interfaces in portable electronics. Consider the 1.57mm x 1.17mm footprint constraints and the requirement for surface-mount assembly techniques compatible with FCBGA packages.
Part Context
This device belongs to the EMIF series from STMicroelectronics, which specializes in integrated solutions for electromagnetic interference mitigation and electrostatic discharge protection. These components are engineered to maintain signal integrity while protecting sensitive downstream electronics from voltage spikes and noise interference common in mobile environments.
Replacement Considerations
Public documentation indicates potential product termination for this specific model. Verify availability of direct substitutes or newer revisions within the EMIF series that maintain identical pinouts and electrical characteristics for seamless integration into existing designs.
