EMIF06-HSD04F3

Overview

The EMIF06-HSD04F3 is a highly integrated EMI filter and ESD protection device manufactured by STMicroelectronics, designed for high-speed SD card interfaces. It utilizes IPAD technology to provide low-pass filtering and electrostatic discharge protection in a single monolithic component. The device features six channels with an RC (Pi) topology, offering a second-order low-pass response. Key electrical parameters include a channel resistance of 1 Ohm and a total capacitance of 4.5 pF. It operates within a temperature range of -40°C to 85°C and is housed in a compact 15-UFBGA, FCBGA package measuring approximately 1.58mm x 1.58mm.

Feature Summary

• Integrates EMI low-pass filtering and ESD protection compliant with IEC standards
• Utilizes IPAD technology for monolithic integration and reduced parasitic elements
• Features smart pin-out configuration to simplify PCB layout
• Includes integrated pull-up resistors to prevent bus floating when no card is connected

Applications

• High-speed SD card interface data lines
• Mobile device data lines
• Mini and micro SD card interfaces

Procurement Notes

Verify the specific suffix 'F3' to confirm the package type and tape-and-reel orientation, as ordering suffixes define physical packaging details rather than functional changes. Confirm availability status, as this component may be subject to obsolescence or lifecycle changes. Ensure compatibility with the target board's footprint dimensions and soldering profile requirements for the UFBGA package.

Selection Notes

Select this component for designs requiring simultaneous EMI suppression and ESD protection on high-speed memory interfaces. The 1-Ohm resistance and 4.5-pF capacitance values are optimized for high-frequency signal integrity while maintaining low power consumption. Consider the small form factor for space-constrained mobile applications. Verify that the 208 MHz clock frequency support meets the system's SDR104 mode requirements.

Part Context

This part belongs to the EMIF06 family from STMicroelectronics, which specializes in complex array configurations for EMI and ESD protection. The series leverages advanced packaging technologies to minimize PCB space consumption while providing high reliability. These devices are specifically engineered for mobile electronics where signal integrity and component count reduction are critical design constraints.

Replacement Considerations

Check for direct substitutes such as EMIF06-HSD03F3 or EMIF06-MSD04F3 if available, noting differences in filter order and package pinout. Ensure any replacement maintains the same channel count and electrical characteristics for the SD interface.