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EMMC16G-IB29-70H01 is listed in the Memory IC range at ChipApex. The manufacturer field lists Kingston. Its product description is I-TEMP EMMC 5.1 (HS400) 153B 16G. Review the specifications below when checking this part for your BOM.
The Kingston EMMC16G-IB29-70H01 is a 16GB Embedded Multi-Media Card (e•MMC™) compliant with the JEDEC e•MMC™ 5.1 standard. It utilizes triple-level cell (TLC) NAND flash memory integrated with an onboard controller within a 153-ball FBGA package measuring 11.5 x 13.0 x 0.8mm. The device supports variable clock frequencies from 0 to 200MHz and offers bus modes including SDR up to 52MB/s, DDR up to 104MB/s, HS200 up to 200MB/s, and HS400 up to 400MB/s. Sequential read performance reaches 300MB/s and sequential write performance reaches 40MB/s at HS400 mode. Operating voltage ranges are VCC = 3.3V and VCCQ = 1.8V or 3.3V. The component operates within a temperature range of -40°C to +85°C.
Verify that the host system supports the required e•MMC 5.1 interface and voltage levels before integration. Confirm that the specific hardware revision and configuration suffixes match the design requirements. Ensure compliance with RoHS standards if applicable to the target market. Check for any specific firmware configurations needed for pSLC mode or partition settings prior to deployment.
Select this component when a compact, industry-standard storage solution is required for commercial or industrial embedded designs. Consider the 16GB capacity and 153-ball package dimensions against available board space. Evaluate the need for HS400 speeds versus lower power consumption modes like Legacy MMC or High Speed SDR based on application bandwidth requirements.
This part belongs to Kingston's family of managed NAND storage solutions designed for long-life commercial and industrial embedded systems. These devices simplify system design by integrating flash management functions such as wear leveling and bad block management into a single package. The e•MMC standard ensures backward compatibility with prior specification revisions, easing product sustainment throughout the lifecycle.
Compatible substitutes include other e•MMC 5.1 devices with similar 16GB capacity and 153-ball FBGA packaging. Verify pinout compatibility and electrical specifications, particularly operating voltages and temperature ranges. Ensure the replacement supports the required bus modes and features such as command queuing or field firmware updates.
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