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The ENGFAM65CR51AXZ2 is a MOSFET Intelligent Power Module (IPM) from onsemi, designed for high-voltage power conversion applications. It integrates silicon carbide (SiC) diodes and operates at a rated voltage of 650V with an on-resistance of 51mΩ. The module utilizes an APM16-CDB package topology featuring an aluminum oxide (Al2O3) substrate for enhanced thermal management. This configuration supports L-forming PFC circuits and other power electronics designs requiring robust switching performance.
Verify the exact part number suffix against official onsemi documentation, as engineering samples or specific tape-and-reel variants may differ from standard production units. Confirm RoHS compliance and automotive qualification status if required for your specific application environment. Ensure the ordering information matches the intended package type and pinout configuration before finalizing procurement.
Select this component when designing systems that require low conduction losses and high thermal stability in a compact form factor. The integration of SiC diodes makes it suitable for high-frequency switching applications where traditional silicon diodes would exhibit excessive heat generation. Evaluate the thermal resistance characteristics of the Al2O3 substrate against your heatsinking capabilities to ensure reliable operation under maximum load conditions.
This module belongs to the FAM65 series of intelligent power modules from onsemi, which are engineered for high-voltage applications up to 650V. The series includes various configurations tailored for different current ratings and package types, supporting both industrial and automotive power electronics needs through integrated protection features and optimized thermal paths.
Direct substitutes within the FAM65 family include FAM65CR51ADZ2 and FAM65HR51XS2, though pinouts and current ratings may vary. Verify compatibility with existing PCB footprints and gate drive requirements before substitution. Cross-reference datasheets for thermal resistance and switching speed differences to ensure system performance remains within specifications.