EP1C4F400C6

Overview

The EP1C4F400C6 is a Field Programmable Gate Array belonging to the Altera Cyclone I family. It features 5980 configurable logic blocks and supports a maximum clock frequency of 275 MHz. The device utilizes a 400-pin Fine-Pitch Ball Grid Array package with dimensions of 21 x 21 mm and a 1.00 mm pitch. It operates within a commercial temperature range of 0°C to 85°C and requires a core voltage supply between 1.42 V and 1.58 V, nominally 1.5 V. The component includes 301 available I/O pins for system interfacing.

Feature Summary

• Integrates 5980 configurable logic blocks for complex digital logic implementation
• Supports high-speed operation with a maximum clock frequency of 275 MHz
• Provides 301 general-purpose input/output pins for flexible peripheral connectivity

Applications

• Industrial control systems requiring programmable logic
• Telecommunications infrastructure signal processing
• Consumer electronics hardware acceleration

Procurement Notes

Verify the specific suffix 'C6' against official manufacturer documentation to confirm the exact speed grade and commercial temperature rating. Ensure compatibility with the required 1.5V core voltage domain and check for lead-free compliance status in current production batches.

Selection Notes

Select this component when 5980 logic elements are sufficient for the design complexity. Compare against other Cyclone I variants based on pin count requirements and specific timing constraints. Confirm that the 400-ball BGA footprint fits the target PCB layout and assembly capabilities.

Part Context

This part belongs to the Cyclone I series, designed as a low-cost FPGA solution. It shares architectural similarities with other members like the EP1C4T324I7ES but differs in package type and pin density. The F400 designation indicates the 400-pin FBGA form factor used in this specific model.

Replacement Considerations

Potential substitutes include other Cyclone I devices with similar logic counts, such as the EP1C4Q240 or EP1C4T324 series, provided the package and pinout requirements align with the existing design constraints.