EP1SGX25CF672C6N

EP1SGX25CF672C6N

  • Description:IC FPGA 455 I/O 672FBGA
  • Series:Stratix® GX

SKU:7c0b5db6ea14 Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 455 I/O 672FBGA
  • Series:Stratix® GX
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:2566
  • Number of Logic Elements/Cells:25660
  • Total RAM Bits:1944576
  • Number of I/O:455
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:672-BBGA
  • Supplier Device Package:672-FBGA (27x27)
  • Number of Gates:-

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EP1SGX25CF672C6N

Overview

The Altera EP1SGX25CF672C6N is a Stratix GX Field-Programmable Gate Array (FPGA) housed in a 672-pin FineLine BGA package. It contains 25,660 logic elements and supports up to eight high-speed serial transceiver channels operating at data rates from 500 Mbps to 3.1875 Gbps. The device features TriMatrix memory with 1,944,576 total RAM bits and includes digital signal processing blocks for multiplier operations. Designed for the -6 speed grade, it operates within a 0°C to 85°C temperature range and utilizes a 1.5-V logic array architecture.

Feature Summary

  • Integrates up to eight high-speed serial transceiver channels with clock data recovery (CDR) supporting full-duplex operation up to 3.1875 Gbps.
  • Contains 25,660 logic elements and 1,944,576 total RAM bits distributed across M512, M4K, and M-RAM block types.
  • Includes programmable pre-emphasis, equalization, and differential output voltage (VOD) settings to optimize signal integrity.
  • Supports source-synchronous interfaces on up to 39 channels for high-speed performance using standards such as LVDS and LVPECL.

Applications

  • High-speed backplane interface systems
  • Chip-to-chip communication links
  • Communications protocol bridging
  • Network/protocol analysis equipment

Procurement Notes

Verify that the specific ordering suffix C6N corresponds to the intended commercial temperature range and lead time requirements. Confirm that the power supply design accommodates the 1.5-V logic array and associated I/O voltages. Ensure the PCB layout supports the 672-pin FineLine BGA package dimensions of 27x27 mm. Check for any required external termination components for the transceiver outputs.

Selection Notes

Select this model when eight transceiver channels are sufficient for the application, as higher density variants like the EP1SGX25F offer sixteen channels. The -6 speed grade provides a balance between performance and power consumption compared to the -5 or -7 grades. Consider vertical migration options within the 672-pin package if future design updates require different logic densities while maintaining pin compatibility.

Part Context

This component belongs to the Stratix GX family, which was designed to combine high-performance logic arrays with embedded high-speed serial transceivers. It serves as an intermediate density option within the EP1SGX25 series, positioned between the EP1SGX10 and higher-capacity devices. The family emphasizes low power consumption and small die size for demanding interface applications.

Replacement Considerations

Vertical migration within the same 672-pin package allows substitution with other EP1SGX25 variants such as EP1SGX25D or EP1SGX25F, provided dedicated and power pins remain compatible. Cross-package replacements require re-design due to differing pin counts and physical dimensions.

EP1SGX25CF672C6NEP1SGX25CF672C6N

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