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The EP1SGX25DF672C5 is a Stratix GX Field Programmable Gate Array (FPGA) manufactured by Altera. It features 25,660 logic elements and 2,566 LABs/CLBs within its architecture. The device includes 1,944,576 total RAM bits for data storage and processing. It provides 455 input/output pins for system connectivity. The component operates at a core voltage range of 1.425 V to 1.575 V. It is housed in a 672-ball Ball Grid Array (BGA) package with dimensions of 27x27 mm. The specified operating temperature range extends from 0°C to 85°C.
Verify the specific suffix C5 against official Intel/Altera documentation to confirm speed grade and commercial temperature rating alignment. Ensure the 672-BGA pinout matches the target PCB footprint exactly. Confirm that the 1.425V–1.575V power supply requirements are met by the system design. Validate that the 0°C to 85°C operating range satisfies environmental constraints. Cross-reference the part number with current datasheets to ensure no obsolescence or revision changes affect functionality.
Select this component when a Stratix GX FPGA with approximately 25K logic elements is required. The 672-pin BGA package suits applications needing high I/O counts without excessive board space. Verify that the commercial temperature range and voltage specifications align with the target system environment. Consider the available RAM capacity for embedded processing needs. Ensure compatibility with Altera development tools for programming and configuration.
This device belongs to the Stratix GX family, designed for high-performance applications. It utilizes Altera's advanced FPGA technology to deliver flexible programmable solutions. The series integrates hard processor system options and high-speed transceivers in other variants, though this specific model focuses on logic density and I/O. It represents a mature product line for industrial and communication markets.
Consult official Intel/Altera cross-reference guides for direct substitutes. Verify pin-to-pin compatibility if considering alternative packages within the same logic density class. Ensure functional equivalence regarding logic element count and memory size. Check for updated speed grades or extended temperature ranges if system requirements have changed.