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EP3SE260F1152I4G is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA 744 I/O 1152FBGA. Review the specifications below when checking this part for your BOM.
The EP3SE260F1152I4G is a Stratix III Field Programmable Gate Array (FPGA) manufactured by Altera. It features 260,000 logic elements and 80,000 Adaptive Logic Modules (ALMs). The device includes 10.4 Mbits of embedded memory, comprising 1250 kbits of Embedded Block RAM (EBR), and supports 744 I/Os. It operates within a voltage range of 1.2 V to 3.3 V and functions at temperatures from -40°C to +85°C. The component is housed in an 1152-pin FineLine Ball-Grid Array (FBGA) package.
Verify the specific ordering suffix 'G' against official manufacturer documentation to confirm RoHS compliance status, as suffixes can indicate environmental certifications. Confirm availability through authorized distributors, noting that older Stratix III devices may have limited stock or end-of-life implications. Ensure the FBGA-1152 package compatibility with your PCB footprint before procurement.
Select this model when a balance of moderate logic density and high I/O count is required for Stratix III applications. Compare against EP3SL200 variants if lower resource usage suffices, or EP3SE260C-series variants if commercial temperature grades are acceptable. Verify that the 1152-pin package fits the mechanical constraints of the target design.
This component belongs to the Altera Stratix III family, designed for mid-to-high-end FPGA applications prior to the introduction of Stratix IV and V series. It utilizes advanced process technology to deliver high performance per watt. The EP3SE260 designation indicates the specific logic and memory capacity within the Stratix III portfolio.
Direct pin-compatible replacements are not publicly documented for this specific legacy part number. Consider Intel/Altera Stratix IV or V series FPGAs for modern equivalents, though these require redesign due to architectural differences. Consult official substitution guides for functional upgrades rather than direct swaps.
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