EPC21601

Overview

The EPC21601 is an eToF laser driver IC integrating a 40 V, 10 A GaN FET with a gate driver and 3.3 V logic input on a single chip. It modulates laser drive currents up to 10 A at frequencies exceeding 100 MHz with pulse widths under 2 ns. The device features turn-on and turn-off times of 410 ps and 320 ps respectively. Operating voltage ranges from 5 V to 30 V with a maximum supply current of 50 mA. It operates within a temperature range of -40°C to +150°C and utilizes a die package.

Feature Summary

• Integrates 40 V, 10 A GaN FET, gate driver, and 3.3 V logic interface on a single chip
• Enables ultra-short pulse modulation for high-resolution distance measurement
• Utilizes proprietary GaN IC technology for compact chip-level BGA footprint

Applications

• Time-of-Flight (ToF) LiDAR systems
• Robotics perception sensors
• Autonomous driving vehicles
• Surveillance and security systems
• Unmanned aerial vehicles (UAVs)

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and specific packaging configuration prior to acquisition. Ensure storage conditions align with moisture sensitivity level requirements. Cross-reference ordering information with official datasheets to validate part number accuracy and revision history before finalizing procurement orders.

Selection Notes

Select this component for applications requiring high-speed laser modulation with minimal PCB area. The integrated design eliminates interconnect inductance associated with discrete solutions. Suitable for indirect ToF applications demanding short pulse widths and high peak currents. Evaluate thermal management capabilities given the wide operating temperature range and high current density requirements in dense packaging environments.

Part Context

The EPC21601 belongs to EPC's eToF laser driver series designed for LiDAR systems. It leverages eGaN technology to combine power switching and control logic. This integration addresses size and performance limitations of traditional MOSFET-based drivers. The component supports advanced 3D sensing in consumer and industrial sectors by enabling smaller, more efficient sensor modules.

Replacement Considerations

No public confirmed substitute part numbers are available.