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F3L340R12W3H7H11BPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is EASY STANDARD PLUS. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for F3L340R12W3H7H11BPSA1
- Description：EASY STANDARD PLUS
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- Technology：-
- Configuration：-
- FET Feature：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for F3L340R12W3H7H11BPSA1
FET, MOSFET Arrays Overview
The Infineon F3L340R12W3H7H11BPSA1 is an EasyPACK™ IGBT module featuring TRENCHSTOP™ IGBT7 technology and emitter-controlled diodes. It provides a collector-emitter voltage of 1200 V, nominal current of 340 A, and peak current of 680 A. The module utilizes PressFIT contact technology and includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C. Operating temperature ranges from -40°C to +175°C junction temperature.
FET, MOSFET Arrays Feature Summary
- Integrates TRENCHSTOP™ IGBT7 chips for low saturation voltage and reduced switching losses
- Features low inductive design with minimal stray inductance
- Includes high-current pins and rugged mounting clamps for secure installation
- Provides 3.2 kV AC insulation isolation using Al2O3 substrate
FET, MOSFET Arrays Applications
- Three-level inverter topologies
- Solar power inverters
- Industrial motor drives
FET, MOSFET Arrays Procurement Notes
Verify the specific ordering suffix BPSA1 against official documentation to confirm exact configuration details. Ensure compatibility with recommended gate drivers listed by the manufacturer. Confirm that the application environment meets the specified industrial qualification standards and thermal requirements before finalizing procurement.
FET, MOSFET Arrays Selection Notes
Select this module for applications requiring high efficiency and robust performance in three-level configurations. Consider the low thermal resistance and integrated NTC for precise thermal management. Verify PCB hole patterns and mounting torque specifications to ensure mechanical integrity during operation under high current loads.
FET, MOSFET Arrays Part Context
This component belongs to the EasyPACK™ series, designed for compact integration in modern power electronics. It utilizes advanced semiconductor technology to deliver high power density. The module is qualified for industrial applications according to relevant international safety and reliability standards.
FET, MOSFET Arrays Replacement Considerations
Consult official substitution lists for verified alternatives. Cross-reference electrical parameters such as voltage class, current ratings, and package dimensions when evaluating potential replacements to ensure functional compatibility.
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