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The F3L75R12W1H3PB11BPSA1 is a silicon-based IGBT module from Infineon Technologies, belonging to the F3LXR12W1J series. It features a 1200 V collector-emitter voltage rating and a continuous collector current of 75 A at 25°C. The component utilizes TRENCHSTOP technology and is housed in a tray package. Key electrical parameters include a maximum collector-emitter saturation voltage of 1.8 V at 240 A with a gate-emitter voltage of 15 V. The module supports an operating junction temperature range from -40°C to +175°C and includes an integrated NTC thermistor for thermal monitoring.
Verify the specific ordering suffix against official documentation to confirm pinout and thermal interface compatibility. Confirm RoHS compliance status through the manufacturer's latest datasheet before integration. Ensure that the selected variant matches the required packaging format for automated assembly processes.
Select this module for applications requiring high voltage isolation and efficient thermal management in three-level topologies. Evaluate the thermal resistance characteristics against the system's heat sink capabilities. Consider the gate drive requirements associated with the specific IGBT technology used in this series.
This component is part of Infineon's broader portfolio of silicon IGBT modules designed for power conversion. It shares architectural similarities with other EasyPACK variants but is distinct in its three-level configuration and specific current ratings within the F3LXR12W1J family.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with any potential alternatives by cross-referencing pin assignments and electrical specifications with official Infineon documentation.
The maximum operating junction temperature is +175°C.
Yes, the module integrates an NTC thermistor for thermal monitoring.
The maximum collector-emitter saturation voltage is 1.8 V when measured at 240 A with a gate-emitter voltage of 15 V.