F56-020

Overview

The Triad Magnetics F56-020 is a laminated core power transformer designed for industrial control applications. It features a single primary winding rated at 115V and dual secondary windings configurable in parallel or series to provide 28V or 56V outputs respectively. The unit has a maximum power rating of 1.1VA, with current capacities of 40mA in parallel configuration and 20mA in series configuration. It utilizes through-hole PC pin termination for secure board mounting.

Feature Summary

• Split bobbin design enables versatile PCB layout options
• Dual secondary windings allow flexible voltage configuration
• Laminated core construction ensures stable performance

Applications

• Industrial control panels
• PCB-mounted power supplies
• Class 2/3 isolation circuits

Procurement Notes

Verify the specific suffix (e.g., -C2) against your schematic requirements, as it may indicate distinct insulation classes or packaging variations. Confirm that the 115V primary input matches your system voltage. Ensure the PCB footprint aligns with the Split Pack™ terminal spacing. Check RoHS compliance status if required by your manufacturing standards.

Selection Notes

Select this component when a compact, low-power transformer is needed for chassis or panel mounting. The split bobbin architecture supports efficient PCB routing compared to concentric designs. Consider the 1.1VA limit for load calculations. Verify that the available secondary voltages meet the downstream circuit requirements without additional regulation.

Part Context

This model belongs to the Split Pack™ series, characterized by nonconcentrically wound bobbins that facilitate easier printed circuit board assembly. The F-series designation typically indicates standard industrial control transformer specifications within the Triad Magnetics portfolio, focusing on reliability and compact form factors for embedded power systems.

Replacement Considerations

The ST-3-56 from Signal Transformer is listed as a similar substitute part number. Verify electrical equivalence and physical dimensions before swapping components to ensure compatibility with existing PCB footprints and thermal constraints.