F6HH2G350EH75-J

$1.72

Description：FBAR TD-LTE/TS-SCDMA BAND 40
Series：F6
Mfr：Taiyo Yuden
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:a8f42b45c4a3 Category: SAW Filters Brand: Taiyo Yuden

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Product introduction

Product Detailed Parameters

Description：FBAR TD-LTE/TS-SCDMA BAND 40
Series：F6
Mfr：Taiyo Yuden
Package：Tape & Reel (TR),Cut Tape (CT)
Frequency - Center：2.35GHz
Bandwidth：-
Insertion Loss：1.4dB
Ratings：-
Applications：LTE, SCDMA
Mounting Type：Surface Mount
Package / Case：5-SMD, No Lead
Height (Max)：0.020" (0.50mm)
Size / Dimension：0.043" L x 0.035" W (1.10mm x 0.90mm)

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F6HH2G350EH75-J

Overview

The F6HH2G350EH75-J is a Surface Acoustic Wave (SAW) filter manufactured by Taiyo Yuden, designed for high-frequency signal conditioning in wireless communication systems. Operating at a center frequency of 2.35 GHz with a 50 Ohm impedance, this component utilizes FBAR/SAW technology to provide effective RF filtering. It is housed in a compact 5-SMD, No Lead package, making it suitable for space-constrained mobile device applications requiring LTE and SCDMA support.

Feature Summary

Utilizes FBAR/SAW technology for high-performance signal conditioning
Designed for low interference in compact wireless designs
Optimized for Bluetooth and Wireless LAN applications

Applications

LTE cellular modules
SCDMA radio systems
Bluetooth transceivers
Wireless LAN interfaces

Procurement Notes

Verify the specific suffix '-J' against official Taiyo Yuden documentation to confirm packaging and tape-and-reel specifications. Ensure compatibility with the target PCB footprint for the 5-SMD no-lead package. Cross-reference the 2.35 GHz center frequency requirement with system schematics to prevent impedance mismatch issues in the RF front-end design.

Selection Notes

Select this component when a SAW filter is required for the 2.35 GHz band within mobile or IoT devices. The choice depends on the need for FBAR/SAW performance characteristics over standard ceramic filters. Consider the 5-SMD no-lead form factor for automated surface-mount assembly processes and strict board real estate limitations typical in modern handheld electronics.

Part Context

This part belongs to Taiyo Yuden's portfolio of high-frequency products, which emphasize compact package sizes and low interference. These components are engineered to meet the demands of latest generation wireless standards, ensuring reliable signal integrity in dense electronic environments where multiple RF protocols operate simultaneously.