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FA-128 32.0000MF09Z-AC0 is listed in the Crystals range at ChipApex. The manufacturer field lists EPSON. Its product description is CRYSTAL 32.0000MHZ 9PF SMD. Review the specifications below when checking this part for your BOM.
The FA-128 32.0000MF09Z-AC0 is a surface-mount crystal unit manufactured by EPSON, designed for high-frequency timing applications. It operates at a nominal frequency of 32 MHz with a frequency stability and tolerance of ±10 ppm. The component features a load capacitance of 9 pF and an equivalent series resistance (ESR) of 60 Ohms maximum. It utilizes a 4-SMD, no-lead package with dimensions of 2.00 mm in length, 1.60 mm in width, and a maximum height of 0.50 mm. The device supports fundamental mode operation and is rated for a working temperature range of -20°C to +75°C.
Verify the specific suffix AC0 against official Epson documentation to confirm exact electrical parameters and packaging details. Ensure compatibility with target circuit load capacitance requirements before integration. Cross-reference part numbers with authorized distributors to avoid counterfeit components. Confirm RoHS compliance status through current datasheets.
Select this component when a compact footprint is required alongside stable 32 MHz timing. Consider the 60 Ohm ESR limit for oscillator circuit design. Evaluate thermal performance within the specified -20°C to +75°C range. Compare against other FA-128 variants if different load capacitances or frequencies are needed.
This part belongs to the FA-128 series of ultra-miniature crystal units from Epson Toyo Com. The series offers various frequencies between 16 MHz and 54 MHz with different load capacitances and ESR values. The FA-128 form factor is standardized across the family, ensuring consistent mechanical mounting while allowing electrical customization.
Direct substitutes include other FA-128 variants with matching 32 MHz frequency and 9 pF load capacitance. Verify that alternative parts maintain the same 60 Ohm maximum ESR and ±10 ppm stability. Check for identical package dimensions to ensure board layout compatibility.
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