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FA4G00EMCV3RBFI is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is INDUSTRIAL TEMP. -40C TO +85C 11. Review the specifications below when checking this part for your BOM.
The FA4G00EMCV3RBFI is a 4 GB embedded MultiMediaCard (eMMC) manufactured by ATP Electronics. It belongs to the E700PC series and utilizes PSLC NAND configuration within an FBGA-153 package measuring 11.5 mm x 13 mm. The component supports eMMC 5.1 interface standards and operates within a commercial temperature range of -25°C to +85°C.
Verify the specific suffix 'I' against official ATP documentation, as distributor listings may contain typographical errors relative to the confirmed 'FC' variant. Confirm RoHS compliance status directly with the manufacturer or authorized channels prior to integration. Ensure the FBGA-153 footprint matches the target PCB design specifications exactly.
Select this component when PSLC endurance characteristics are required for commercial applications operating between -25°C and +85°C. The 4 GB capacity suits lightweight embedded OS deployments. Verify that the eMMC 5.1 interface compatibility aligns with the host controller's capabilities.
This part is part of the ATP E700PC series, designed for commercial environments. It shares the physical FBGA-153 form factor with other models in the lineup but differs in NAND type and temperature rating. The series targets reliable data storage for compact embedded electronics.
The FM8G00EMCV3RBFI offers similar industrial temperature ranges but uses MLC NAND. Cross-referencing with the FA4G00EMCV3RBFC is necessary to confirm if the 'I' suffix denotes a specific industrial grade variant not explicitly detailed in public distributor summaries.
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