FA8G00EMCV3RBFC

$9.21

Description：COMMERCIAL TEMP. -25C TO +85C 11
Series：-
Mfr：ATP Electronics, Inc.
Package：Tray

SKU:10751da63cca Category: Memory IC Brand: ATP Electronics, Inc.

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

FA8G00EMCV3RBFC is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is COMMERCIAL TEMP. -25C TO +85C 11. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FA8G00EMCV3RBFC

Description：COMMERCIAL TEMP. -25C TO +85C 11
Series：-
Mfr：ATP Electronics, Inc.
Package：Tray
Memory Type：-
Memory Format：-
Technology：-
Memory Size：-
Memory Organization：-
Memory Interface：-
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for FA8G00EMCV3RBFC

FA8G00EMCV3RBFC

Memory IC Overview

The FA8G00EMCV3RBFC is an eMMC memory device from ATP Electronics, belonging to the E700Pc series. It utilizes a pSLC configuration and is housed in an FBGA-153 package with dimensions of 11.5x13 mm. The component supports surface mount installation and operates within a commercial temperature range of -25°C to +85°C.

Memory IC Feature Summary

Supports pSLC configuration for enhanced data retention and endurance compared to standard MLC.

Memory IC Applications

Commercial embedded storage systems
Industrial control units requiring extended temperature tolerance
Portable electronic devices

Memory IC Procurement Notes

Verify current availability status as distribution may be restricted in certain regions. Confirm RoHS compliance details through official manufacturer documentation before integration. Ensure ECAD models are compatible with design tools. Check for any specific handling requirements related to moisture sensitivity levels during assembly.

Memory IC Selection Notes

Select this component when pSLC reliability is required within the specified commercial temperature range. The FBGA-153 package suits compact designs. Compare against MLC variants like FM16G0EMCV3RBFC if higher density is needed but endurance is less critical. Verify interface compatibility with host controllers supporting standard eMMC protocols.

Memory IC Part Context

This part belongs to the E700Pc series of eMMC solutions by ATP Electronics. It shares the FBGA-153 footprint with other models in the lineup but differs in cell type (pSLC vs MLC) and capacity. It targets applications needing robust data integrity over high-density storage needs.