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FA8G00EMCV3RBFI is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is INDUSTRIAL TEMP. -40C TO +85C 11. Review the specifications below when checking this part for your BOM.
The FA8G00EMCV3RBFI is an embedded multimedia card (eMMC) manufactured by ATP Electronics, belonging to the E700Pc series. It utilizes a 153-ball FBGA package with dimensions of 11.5 mm x 13 mm. The device employs pSLC NAND flash configuration and supports the eMMC 5.1 interface standard. It operates within a commercial temperature range from -25°C to +85°C and features surface-mount technology (SMD/SMT) installation style.
Verify component authenticity through authorized ATP Electronics distributors or official channels. Confirm RoHS compliance status via current datasheets. Check for restricted supply conditions as availability may vary. Ensure compatibility with host system interfaces before procurement.
Select this model for applications requiring pSLC endurance within the E700Pc series. Compare against FM8G00EMCV3RBFI if industrial temperature ratings (-40°C to +85°C) are required instead of commercial ranges. Verify package compatibility with PCB layout constraints.
This component is part of ATP Electronics' embedded flash storage portfolio, specifically the E700Pc series designed for commercial temperature environments. It integrates NAND flash, controller, and MMC interface for compact embedded solutions.
FM8G00EMCV3RBFI offers similar specifications but supports an extended industrial temperature range (-40°C to +85°C). FM16G0EMCV3RBFC provides MLC configuration with higher capacity options. Verify pinout and electrical compatibility before substitution.
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