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FAN3227TMPX is listed in the Gate Driver range at ChipApex. The manufacturer field lists onsemi. Its product description is IC GATE DRVR LOW-SIDE 8MLP. Review the specifications below when checking this part for your BOM.
The FAN3227TMPX is a dual low-side MOSFET gate driver manufactured by onsemi, designed for high-speed switching applications. It operates within a supply voltage range of 4.5 V to 18 V and delivers a peak output current of 2 A per channel. The device features non-inverting logic configuration with typical rise and fall times of 12 ns and 9 ns, respectively. It is housed in an MLP-8 surface-mount package and supports operation across an extended temperature range from -40 °C to +125 °C. The component draws a quiescent supply current of 750 µA and dissipates up to 460 mW of power.
Verify the specific ordering suffix to ensure compatibility with required packaging formats such as cut tape or reel configurations. Confirm that the MLP-8 package dimensions align with the target PCB footprint and thermal design requirements. Cross-reference the manufacturer datasheet for detailed electrical characteristics and absolute maximum ratings before finalizing procurement decisions.
Select this component when dual low-side driving is required with moderate current capabilities. The non-inverting configuration simplifies logic interface design compared to complementary options. Ensure the application voltage remains within the 4.5 V to 18 V operational window. Consider the MLP-8 package size constraints and thermal management needs for high-frequency switching environments.
This part belongs to the FAN3227T series of gate drivers, which are optimized for efficient power management in various electronic systems. The series focuses on providing reliable switching performance with minimal propagation delay. It serves as a critical interface between control logic and power switches, ensuring stable operation under varying load conditions.
The FAN3227TMX-F085 is a documented alternative variant featuring AEC-Q101 automotive qualification and SOIC-8 packaging. Verify pinout compatibility and thermal characteristics when substituting components to maintain system integrity.
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