FB321611T-401Y-S

Chip Ferrite Bead Overview

The FB321611T-401Y-S is a multilayer ferrite chip bead manufactured by Cal-Chip Electronics, Inc. in a 1206 surface-mount package. It provides an impedance of 400 Ohms at 100 MHz with a maximum DC resistance of 0.25 Ohms and a current rating of 350 mA. The component measures 3.2 mm in length, 1.6 mm in width, and 1.3 mm in height. Designed for EMI/RFI attenuation, it supports flow, reflow, and wave soldering processes.

Chip Ferrite Bead Feature Summary

• Multilayer ferrite construction for high electrode strength and solder heat resistance
• Eliminates the need for additional wiring to suppress electromagnetic interference
• Optimized for surface mounting applications requiring robust solderability

Chip Ferrite Bead Applications

• EMI/RFI suppression in electronic equipment
• Signal line filtering for noise attenuation
• Surface mount assembly for compact circuit designs

Chip Ferrite Bead Procurement Notes

Verify RoHS compliance status and lead-free configuration prior to ordering. Confirm that the 1206 package dimensions align with PCB footprint requirements. Ensure the 350 mA current rating meets the operational load of the target circuit to prevent saturation or thermal issues during procurement validation.

Chip Ferrite Bead Selection Notes

Select this component when a 400 Ohm impedance at 100 MHz is required within a 1206 footprint. Consider the 0.25 Ohm DC resistance impact on signal integrity. Evaluate the 350 mA current limit against peak circuit demands. Compare against alternative impedances if frequency response characteristics differ from system requirements.

Chip Ferrite Bead Part Context

This part belongs to the FB series of multilayer ferrite chip beads from Cal-Chip Electronics. These components utilize magnetic material technology to provide effective noise suppression without external wiring. The series offers various sizes to accommodate diverse surface-mount application needs across consumer and industrial electronics.

Chip Ferrite Bead Replacement Considerations

Substitutes must match the 1206 package size, 400 Ohm impedance at 100 MHz, and similar current handling capabilities. Verify equivalent DC resistance and physical dimensions to ensure board compatibility. Cross-reference manufacturer datasheets for functional equivalence in EMI suppression performance.