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FBA321611T-600Y-S is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is FERRITE BEAD 60 OHM 1206 1LN. Review the specifications below when checking this part for your BOM.
The FBA321611T-600Y-S is a multilayer ferrite chip EMI suppressor manufactured by Cal-Chip Electronics, Inc. It operates as a single-function filter with an impedance of 60 Ohms at 100 MHz and a maximum DC current rating of 400 mA. The component features a low DC resistance of 200 mOhm and is housed in a 1206 (3216 Metric) surface mount package with an 8-pad array configuration. Designed for high solder heat resistance and outstanding solderability, it supports flow, reflow, and wave soldering processes.
Verify the specific impedance value and DC current rating against the official manufacturer datasheet before integration. Confirm that the 1206 array package dimensions align with the target PCB footprint. Ensure compliance with RoHS standards if required by the end product specifications. Cross-reference the part number to confirm active status and availability from authorized sources.
Select this component when a compact surface mount solution is needed for suppressing electromagnetic interference on power or signal lines. The 60 Ohm impedance at 100 MHz suits applications requiring moderate attenuation. The 400 mA current rating determines suitability for low-power circuits. The 1206 array package facilitates automated placement while maintaining a small board area.
This ferrite chip belongs to the FB series of multilayer EMI suppressors from Cal-Chip Electronics. These components utilize magnetic material and multilayered technology to provide high impedance for volume noise reduction. The series is designed to eliminate EMI/RFI simply by mounting onto the PCB, offering a space-saving alternative to conventional wire-wound beads.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing designs by matching impedance characteristics, current ratings, and physical package dimensions.
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