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FBH201209T-170Y-S is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is FERRITE BEAD 17 OHM 0805 1LN. Review the specifications below when checking this part for your BOM.
The FBH201209T-170Y-S is a single-function surface-mount ferrite chip bead manufactured by Cal-Chip Electronics, Inc. Housed in an 0805 (2012 Metric) package with dimensions of 2.0 mm length, 1.25 mm width, and 0.9 mm height, this component is designed for EMI/RFI attenuation. It exhibits an output impedance of 17 Ohms at 100 MHz and supports a maximum current rating of 3 Amperes. The device features a low maximum DC resistance of 30 milliohms, ensuring minimal signal loss while providing effective noise suppression in power line applications.
Verify the specific impedance value of 17 Ohms at 100 MHz against your circuit requirements. Confirm the 3A current rating and 30mOhm DC resistance are sufficient for your application's load conditions. Ensure the 0805 package size fits your PCB footprint constraints. Check RoHS compliance status if required by your manufacturing standards.
Select this component when a low-profile surface-mount solution is needed for power line noise suppression. The 17 Ohm impedance offers moderate attenuation suitable for general EMI control. Consider the 3A current handling capability for higher power applications compared to lower-rated beads. The 0805 form factor balances size and performance for standard board layouts.
This ferrite bead belongs to the FBH series from Cal-Chip Electronics, which utilizes multilayer technology for enhanced performance. The series is characterized by high impedance values and robust construction for reliable operation in various electronic devices. These components are specifically designed to replace conventional wire-wound beads, simplifying assembly processes.
Direct substitutes include other 0805 ferrite beads with similar 17 Ohm impedance at 100 MHz and comparable current ratings. Verify that alternative parts maintain the same physical dimensions and thermal characteristics to ensure compatibility with existing soldering profiles and PCB designs.
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