FBH321611T-391Y-S

Chip Ferrite Bead Overview

The FBH321611T-391Y-S is a multilayer ferrite chip bead manufactured by Cal-Chip Electronics, Inc. It features a 1206 (3216 Metric) surface mount package with dimensions of 3.2 mm length and 1.6 mm width. The component provides an impedance of 390 Ohms at 100 MHz and has a maximum DC resistance of 90 mOhm. It operates within a temperature range of -55°C to 125°C.

Chip Ferrite Bead Feature Summary

• Multilayer ferrite construction for EMI/RFI attenuation
• Designed for surface mounting applications including reflow and wave soldering
• High electrode strength and solder heat resistance

Chip Ferrite Bead Applications

• EMI suppression in electronic equipment
• Power line filtering
• Signal line noise reduction

Chip Ferrite Bead Procurement Notes

Verify the specific impedance value and DC resistance against the official Cal-Chip Electronics datasheet for the FBH321611T-391Y-S part number. Ensure the 1206 package size matches the design requirements. Confirm compliance with RoHS standards and lead-free specifications as documented in the manufacturer's product identification records.

Chip Ferrite Bead Selection Notes

Select this component based on the required 390 Ohm impedance at 100 MHz and the 90 mOhm maximum DC resistance limit. The 1206 package size must fit the PCB layout constraints. Verify that the operating temperature range of -55°C to 125°C meets the environmental conditions of the target application.

Chip Ferrite Bead Part Context

This ferrite chip belongs to the FBH series from Cal-Chip Electronics, designed for high impedance volume production. It utilizes multilayered technology to provide effective EMI suppression without requiring additional wiring. The series is engineered for reliability in surface mount processes.

Chip Ferrite Bead Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer for direct equivalents or cross-reference options based on impedance and package compatibility.