FBU565018T-101Y-S

Chip Ferrite Bead Overview

The FBU565018T-101Y-S is a multilayer ferrite chip bead manufactured by Cal-Chip Electronics, Inc. It features a surface mount package in the 2220 (5750 Metric) size with dimensions of 5.7 mm length and 5.0 mm width. The component provides an impedance of 100 Ohms at 100 MHz and supports a current rating of 6A. Its maximum DC resistance is specified as 6 mOhm. Designed for EMI/RFI attenuation, it utilizes magnetic material and multilayered technology to offer high impedance performance while maintaining excellent solderability and heat resistance for reflow and wave soldering applications.

Chip Ferrite Bead Feature Summary

• Provides effective EMI/RFI attenuation through multilayer ferrite technology
• Designed for direct PCB mounting without additional wiring requirements
• Offers high electrode strength and resistance to soldering heat

Chip Ferrite Bead Applications

• Power line filtering in electronic equipment
• Surface mount assembly for EMI suppression
• High-current circuit protection

Chip Ferrite Bead Procurement Notes

Verify the manufacturer part number against official Cal-Chip Electronics documentation to ensure authenticity. Confirm that the specific suffix matches the required impedance and current ratings. Check compliance with RoHS standards if applicable to your manufacturing process. Ensure the supplier provides valid traceability documents for quality assurance purposes before finalizing procurement.

Chip Ferrite Bead Selection Notes

Select this component when high current handling capability up to 6A is required alongside significant impedance at 100 MHz. The 2220 package size accommodates larger physical footprints suitable for power lines. Consider the low DC resistance of 6 mOhm to minimize voltage drop in sensitive circuits. Ensure the application environment supports the thermal characteristics of multilayer ferrite beads during soldering processes.

Chip Ferrite Bead Part Context

This ferrite bead belongs to the FBU series from Cal-Chip Electronics, which specializes in surface-mounted devices. The series utilizes multilayered technology to achieve high impedance in compact packages. These components are engineered to replace conventional wire-wound beads, simplifying the assembly process by allowing direct placement on printed circuit boards for efficient noise suppression.

Chip Ferrite Bead Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Verify compatibility with existing designs by matching impedance curves, current ratings, and physical dimensions before considering alternative components.