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FBU565018T-181Y-S is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is FERRITE BEAD 180 OHM 2220 1LN. Review the specifications below when checking this part for your BOM.
The FBU565018T-181Y-S is a multilayer ferrite chip bead manufactured by Cal-Chip Electronics, Inc. It features a 2220 (5750 Metric) surface mount package with dimensions of 5.7 mm length and 2.0 mm width. The component provides an impedance of 180 Ohms at 100 MHz and supports a current rating of 5A. Its maximum DC resistance is specified as 0.02 Ohms. Designed for EMI/RFI attenuation, it utilizes magnetic material and multilayered technology to offer high impedance without requiring additional wiring.
Verify the manufacturer part number against official Cal-Chip Electronics documentation to ensure authenticity. Confirm that the component meets RoHS compliance standards if required by your project specifications. Check the datasheet for specific handling instructions related to its surface mount package and soldering temperature profiles to prevent damage during assembly.
Select this component when high current handling capability of 5A is required alongside significant impedance at 100 MHz. The 2220 package size allows for robust mechanical stability and thermal performance. Ensure the application benefits from the low DC resistance of 0.02 Ohms to minimize power loss in power lines.
This ferrite bead belongs to the FB Ultra series from Cal-Chip Electronics, designed for advanced EMI suppression. The series utilizes specialized magnetic materials and multilayer construction to achieve high performance in small footprints. These components are engineered to replace conventional beads that require additional wiring, simplifying the PCB layout process.
Consult official Cal-Chip Electronics substitution guides for verified alternatives. Ensure any replacement matches the 2220 package dimensions, 5A current rating, and 180 Ohm impedance at 100 MHz. Verify compatibility with existing soldering processes and PCB design constraints before switching.
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