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FDMF3030 is listed in the Full Half-Bridge (H Bridge) Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC HALF BRIDGE DRIVER 50A 40PQFN. Review the specifications below when checking this part for your BOM.
The FDMF3030 is a half-bridge gate driver integrated into a DrMOS module by onsemi, designed for synchronous buck converters. It operates within a supply voltage range of 4.5V to 5.5V and supports load voltages from 3V to 24V. The device features a 40-PQFN (6x6) package with an operating junction temperature range of -40°C to 150°C. Typical on-resistance values are 900 mΩ for the low-side and 800 mΩ for the high-side MOSFETs. It includes bootstrap circuitry, diode emulation, status flags, and protection against overtemperature, shoot-through, and under-voltage lockout.
Verify component authenticity through authorized channels due to End-of-Life status. Confirm package integrity and pin alignment upon receipt. Review manufacturer documentation for handling precautions related to the PQFN form factor. Ensure compatibility with existing thermal management infrastructure given the specified junction temperature limits.
Select this component for applications requiring integrated high-current switching with minimal external bill of materials. Evaluate thermal performance requirements against the 6x6 mm footprint constraints. Consider the specific on-resistance characteristics for efficiency calculations. Verify that input control signals align with the PWM interface specifications.
This part belongs to the SyncFET and PowerTrench families from onsemi. It represents a consolidated solution combining gate driving logic with power switching elements. The technology aims to reduce board space and simplify design complexity for power management applications compared to discrete implementations.
The manufacturer has declared this product obsolete. Engineers must identify alternative components that match the 40-PQFN (6x6) package dimensions and electrical parameters. Verify pin-to-pin compatibility and thermal characteristics before finalizing any substitution strategy.
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