Memory IC FEMC002GTTE7-T14-17 product image

FEMC002GTTE7-T14-17

$19.67
  • Description:IC FLASH 16GBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:1e7557e91148 Category: Brand:

  
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FEMC002GTTE7-T14-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 16GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC002GTTE7-T14-17

  • Description:IC FLASH 16GBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (pSLC)
  • Memory Size:16Gbit
  • Memory Organization:2G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC002GTTE7-T14-17

FEMC002GTTE7-T14-17

Memory IC Overview

The FEMC002GTTE7-T14-17 is a non-volatile NAND flash memory IC utilizing pSLC technology, manufactured by Flexxon Pte Ltd. It features a storage capacity of 16Gb with an organization of 2G x 8 bits. The device operates within a voltage range of 2.7V to 3.6V and supports a clock frequency of 200 MHz. It utilizes the eMMC interface protocol and is housed in a 153-FBGA package measuring 11.5x13 mm. The component is designed for surface mount installation and functions reliably across a temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Integrates embedded flash controller with standard NAND flash memory in a JEDEC standard package
  • Supports field firmware updates and power-off notification capabilities
  • Complies with eMMC specification standards for high-speed data transfer

Memory IC Applications

  • Small electronic devices requiring low power consumption
  • Embedded systems needing reliable non-volatile storage
  • Industrial applications operating in extended temperature environments

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct pinout and electrical characteristics. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into the assembly process. Ensure the supplier provides valid traceability documentation for the batch produced by Flexxon Pte Ltd.

Memory IC Selection Notes

Select this component when a robust pSLC NAND solution is required for embedded multimedia card applications. Consider the 153-FBGA footprint constraints and the 200 MHz clock speed capability during PCB layout design. Evaluate the thermal performance within the specified -40°C to 85°C operational range to ensure long-term reliability in the target environment.

Memory IC Part Context

This part belongs to the XTRA III series of eMMC flash memories from Flexxon Pte Ltd. It is distinct from other series such as XTRA VII which may offer different capacities or technologies like 3D TLC. The FEMC002 base number indicates its classification within the company's embedded memory product line focused on industrial and commercial grade specifications.

FEMC002GTTE7-T14-17FEMC002GTTE7-T14-17
$19.67
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