FEMC002GTTG7-T24-17

Memory IC Overview

The FEMC002GTTG7-T24-17 is a non-volatile flash memory integrated circuit manufactured by Flexxon Pte Ltd. It utilizes NAND pSLC technology and adheres to the eMMC interface standard. The device offers a storage capacity of 16 Gb with an organization of 2G x 8. It operates within a voltage range of 2.7V to 3.6V and supports clock frequencies up to 200 MHz. The component is housed in a 153-FBGA package measuring 11.5x13 mm, suitable for surface mount installation. It functions reliably across an industrial temperature range of -40°C to 85°C.

Memory IC Feature Summary

• Integrates embedded flash controller with NAND pSLC memory for reliable data retention
• Complies with JEDEC eMMC standards for standardized host communication
• Supports field firmware updates and power-off notification mechanisms

Memory IC Applications

• Industrial control systems requiring robust data logging
• Automotive infotainment and telematics units
• Embedded consumer electronics with high reliability demands

Memory IC Procurement Notes

Verify the exact suffix against official Flexxon documentation to confirm pinout and electrical characteristics. Ensure compatibility with the target host controller's eMMC version support. Confirm RoHS compliance status for specific regional regulatory requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when long-term data retention and high endurance are critical for the application. The pSLC mode provides superior write performance and lifespan compared to standard MLC or TLC configurations. Ensure the design accommodates the 153-FBGA footprint and thermal dissipation requirements for the specified operating temperature range.

Memory IC Part Context

This part belongs to the XTRA III series of eMMC flash memories from Flexxon. The series is designed for applications demanding high reliability and extended operational lifespans. It represents a solution for embedded storage where data integrity under harsh environmental conditions is a primary design constraint.

Memory IC Replacement Considerations

Consult Flexxon official documentation for verified cross-reference part numbers. Do not substitute with generic eMMC components without verifying pin compatibility and electrical specifications.