FEMC004G-M10

Memory IC Overview

The FEMC004G-M10 is an embedded multimedia card (eMMC) flash memory device manufactured by Flexxon Pte Ltd. It features a 32 Gbit (4 GB) capacity utilizing Multi-Level Cell (MLC) NAND technology. The component operates with a clock frequency up to 200 MHz and supports the eMMC 5.1 interface standard. It utilizes a 153-ball Fine-pitch Ball Grid Array (FBGA) package. Electrical specifications include VCCQ voltage options of 1.8V or 3.3V, and a VCC supply of 3.3V. The device offers an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Hardware encryption function for data security
• ECC error correction capability
• Software write protection function

Memory IC Applications

• Industrial control systems
• Medical devices
• Automotive electronics

Memory IC Procurement Notes

Verify the specific package type and voltage requirements against your design schematic before ordering. Confirm that the supplier provides original manufacturer documentation to ensure authenticity. Check for any specific handling instructions related to ESD sensitivity during storage and assembly processes.

Memory IC Selection Notes

Select this component when an industrial-grade eMMC solution with hardware encryption and ECC is required. Ensure the host controller supports the eMMC 5.1 protocol and can accommodate the 153 FBGA footprint. Verify power supply compatibility with the specified 1.8V/3.3V VCCQ and 3.3V VCC levels.

Memory IC Part Context

This part belongs to the ECON II series of embedded flash memory solutions from Flexxon. The series targets high-reliability applications in industrial, medical, and automotive sectors. It combines embedded flash with a dedicated controller to provide robust storage performance under demanding environmental conditions.

Memory IC Replacement Considerations

Check for compatible eMMC 5.1 devices with similar capacity and package dimensions. Ensure substitute parts support the same voltage ranges and temperature specifications. Verify pinout compatibility if direct replacement is intended without PCB redesign.