Memory IC FEMC004GSTE9-T13-17 product image

FEMC004GSTE9-T13-17

$12.22
  • Description:IC FLASH 32GBIT EMMC 100LBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:ad1f0ecdf300 Category: Brand:

  
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FEMC004GSTE9-T13-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 32GBIT EMMC 100LBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC004GSTE9-T13-17

  • Description:IC FLASH 32GBIT EMMC 100LBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (pSLC)
  • Memory Size:32Gbit
  • Memory Organization:4G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC004GSTE9-T13-17

FEMC004GSTE9-T13-17

Memory IC Overview

The FEMC004GSTE9-T13-17 is a pSLC NAND flash memory IC from the XTRA III series, manufactured by Flexxon Pte Ltd. It features a storage capacity of 32 Gbit (4 GB) organized as 4G x 8. The device utilizes an eMMC interface compliant with JEDEC eMMC 5.1 standards and operates at a clock frequency of 200 MHz. Power supply voltage ranges from 2.7V to 3.6V. It is housed in a 100-VFBGA package and supports an industrial operating temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 standard for reliable data management
  • Utilizes pSLC NAND technology for enhanced endurance and stability
  • Integrates hardware-level protection mechanisms for critical data security

Memory IC Applications

  • Industrial automation systems requiring robust storage
  • Medical devices demanding high reliability
  • Automotive electronics operating in harsh environments
  • Telecommunications infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix T13-17 against official Flexxon documentation to confirm package type and temperature grade. Ensure compatibility with host controller eMMC 5.1 support. Confirm RoHS3 compliance status if required by regional regulations. Cross-reference part number with manufacturer datasheets to avoid substitution errors.

Memory IC Selection Notes

Select this component when industrial-grade endurance and wide temperature operation are required. The pSLC configuration offers superior write performance and lifespan compared to standard MLC or TLC options. Verify that the host system supports the 2.7V to 3.6V voltage range and 200 MHz clock speed requirements before integration.

Memory IC Part Context

This part belongs to the Flexxon XTRA III series, designed for industrial applications. It represents a specialized eMMC solution focusing on data integrity and longevity in demanding conditions. The series integrates advanced wear leveling and error correction capabilities inherent to pSLC architectures.

Memory IC Replacement Considerations

Consult Flexxon official documentation for verified cross-references. Generic eMMC replacements may lack the specific pSLC endurance characteristics or industrial temperature ratings required for this application.

FEMC004GSTE9-T13-17FEMC004GSTE9-T13-17
$12.22
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