FEMC004GSTE9-T14-17

Memory IC Overview

The FEMC004GSTE9-T14-17 is a 4 GB MLC NAND flash memory device from Flexxon’s XTRA III series, compliant with the JEDEC eMMC 5.1 standard. It utilizes Pseudo SLC technology to enhance endurance and reliability in industrial environments. The component features a 153-pin FBGA package (11.5 mm footprint) designed for surface mount applications. It operates within an extended temperature range of -40°C to +85°C (TA), ensuring stable performance under harsh conditions. This storage solution integrates hardware-level protection mechanisms to safeguard critical data integrity.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 standard for universal compatibility
• Utilizes Pseudo SLC technology for improved endurance
• Integrates hardware-level protection for data security
• Operates reliably in extended industrial temperature ranges

Memory IC Applications

• Industrial automation systems requiring rugged storage
• Medical devices demanding high data integrity
• Automotive embedded control units
• Telecommunications infrastructure equipment

Memory IC Procurement Notes

Verify the specific revision suffix and packaging configuration against official Flexxon documentation before procurement. Confirm that the 153-VFBGA pinout matches your PCB layout requirements. Ensure the selected variant supports the required operating temperature range for your specific application environment. Cross-reference the part number with authorized distributors to guarantee authenticity and traceability.

Memory IC Selection Notes

Select this component when JEDEC eMMC 5.1 interface compatibility is required alongside industrial-grade thermal stability. The Pseudo SLC mode offers a balance between cost and endurance suitable for moderate write-intensive applications. Consider the 153-pin FBGA form factor for space-constrained designs. Validate that the 4 GB capacity meets system storage needs without excessive overhead.

Memory IC Part Context

This part belongs to Flexxon’s XTRA III series, which focuses on robust NAND flash solutions for critical applications. The series emphasizes data retention and endurance through proprietary controller algorithms and hardware protections. Flexxon targets sectors where standard commercial components fail due to environmental stress or reliability demands.

Memory IC Replacement Considerations

Direct substitutes must match the 153-FBGA package, eMMC 5.1 protocol, and -40°C to +85°C temperature range. Verify pin-to-pin compatibility and electrical characteristics before substitution. Consult Flexxon’s official cross-reference lists for approved alternatives.