Memory IC FEMC004GTTE7-T13-17 product image

FEMC004GTTE7-T13-17

$35.85
  • Description:IC FLASH 32GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:dfd28ae5f423 Category: Brand:

  
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FEMC004GTTE7-T13-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 32GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC004GTTE7-T13-17

  • Description:IC FLASH 32GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (pSLC)
  • Memory Size:32Gbit
  • Memory Organization:4G x 8
  • Memory Interface:eMMC_5
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC004GTTE7-T13-17

FEMC004GTTE7-T13-17

Memory IC Overview

The FEMC004GTTE7-T13-17 is a non-volatile flash memory IC from Flexxon Pte Ltd, belonging to the XTRA III series. It utilizes NAND (pSLC) technology and supports the eMMC interface with a clock frequency of 200 MHz. The device offers a storage capacity of 32 Gbit, organized as 4G x 8 bits. It operates within a voltage range of 2.7V to 3.6V and functions at temperatures between -40°C and 85°C. The component is housed in a 100-FBGA package measuring 14x18 mm.

Memory IC Feature Summary

  • Industrial-grade reliability with pSLC NAND technology for enhanced endurance
  • Compliance with JEDEC eMMC 4.5 standard specifications
  • Integrated hardware encryption and power lock protection mechanisms

Memory IC Applications

  • Harsh environment industrial control systems
  • Rugged embedded storage solutions
  • Critical infrastructure data logging

Memory IC Procurement Notes

Verify the specific suffix T13-17 against official Flexxon documentation to confirm pinout and thermal characteristics. Ensure compatibility with existing PCB footprints for the 100-FBGA package. Confirm RoHS3 compliance status if required by regional regulations. Cross-reference the manufacturer part number directly with authorized distributors to avoid counterfeit components.

Memory IC Selection Notes

Select this model when high endurance and wide temperature operation are required. The pSLC configuration provides better write cycle tolerance compared to MLC or TLC alternatives. Verify that the 200 MHz interface speed meets system bandwidth requirements. Consider the 100-FBGA form factor for space-constrained industrial designs requiring robust data retention.

Memory IC Part Context

This component is part of Flexxon's XTRA III series, designed specifically for industrial applications. The series emphasizes durability and data integrity in challenging conditions. Flexxon specializes in rugged storage solutions, positioning this eMMC device for markets demanding higher reliability than consumer-grade equivalents.

Memory IC Replacement Considerations

FEMC004GTTE7-T13-18 is a related variant within the same series but may differ in specific electrical or mechanical parameters. Direct substitution requires verification of package dimensions and pin configurations against the original design.

FEMC004GTTE7-T13-17FEMC004GTTE7-T13-17
$35.85
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