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FEMC004GTTE7-T13-17 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 32GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.
The FEMC004GTTE7-T13-17 is a non-volatile flash memory IC from Flexxon Pte Ltd, belonging to the XTRA III series. It utilizes NAND (pSLC) technology and supports the eMMC interface with a clock frequency of 200 MHz. The device offers a storage capacity of 32 Gbit, organized as 4G x 8 bits. It operates within a voltage range of 2.7V to 3.6V and functions at temperatures between -40°C and 85°C. The component is housed in a 100-FBGA package measuring 14x18 mm.
Verify the specific suffix T13-17 against official Flexxon documentation to confirm pinout and thermal characteristics. Ensure compatibility with existing PCB footprints for the 100-FBGA package. Confirm RoHS3 compliance status if required by regional regulations. Cross-reference the manufacturer part number directly with authorized distributors to avoid counterfeit components.
Select this model when high endurance and wide temperature operation are required. The pSLC configuration provides better write cycle tolerance compared to MLC or TLC alternatives. Verify that the 200 MHz interface speed meets system bandwidth requirements. Consider the 100-FBGA form factor for space-constrained industrial designs requiring robust data retention.
This component is part of Flexxon's XTRA III series, designed specifically for industrial applications. The series emphasizes durability and data integrity in challenging conditions. Flexxon specializes in rugged storage solutions, positioning this eMMC device for markets demanding higher reliability than consumer-grade equivalents.
FEMC004GTTE7-T13-18 is a related variant within the same series but may differ in specific electrical or mechanical parameters. Direct substitution requires verification of package dimensions and pin configurations against the original design.
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