Memory IC FEMC004GTTE7-T13-18 product image

FEMC004GTTE7-T13-18

$11.93
  • Description:IC FLASH 32GBIT EMMC 4.5 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:cc171cca75b9 Category: Brand:

  
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FEMC004GTTE7-T13-18 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 32GBIT EMMC 4.5 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC004GTTE7-T13-18

  • Description:IC FLASH 32GBIT EMMC 4.5 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:32Gbit
  • Memory Organization:4G x 8
  • Memory Interface:eMMC_4.5
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC004GTTE7-T13-18

FEMC004GTTE7-T13-18

Memory IC Overview

The FEMC004GTTE7-T13-18 is a 32Gbit NAND flash memory IC from the XTRA III series, manufactured by Flexxon Pte Ltd. It implements the eMMC 4.5 interface with a clock frequency of 200 MHz. The device utilizes MLC NAND technology and is housed in a 100-FBGA package measuring 14x18 mm. It operates within a voltage range of 2.7V to 3.6V and supports an industrial temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Compliant with JEDEC eMMC 4.5 standard for standardized host-controller communication
  • Industrial-grade reliability using MLC NAND technology for extended operational lifespan
  • High-speed data transfer capability supported by 200 MHz clock frequency

Memory IC Applications

  • Industrial embedded storage systems requiring wide temperature tolerance
  • Automotive infotainment and telematics units
  • Medical imaging devices and diagnostic equipment
  • Smart metering and IoT gateways

Memory IC Procurement Notes

Verify the exact suffix T13-18 against official Flexxon documentation to confirm package dimensions and pinout compatibility. Confirm RoHS3 compliance status directly with the manufacturer or authorized distributors. Ensure supply chain sources are authorized to guarantee component authenticity and traceability for industrial applications.

Memory IC Selection Notes

Select this component when a 32Gbit capacity is required alongside strict adherence to the eMMC 4.5 protocol. The industrial temperature rating makes it suitable for harsh environments where commercial grade parts would fail. Consider the 100-FBGA footprint during PCB layout design to ensure adequate thermal dissipation and signal integrity for high-speed interfaces.

Memory IC Part Context

This part belongs to the Flexxon XTRA III series, which focuses on industrial-grade NAND flash solutions. The series is designed to meet the rigorous demands of long-term deployment in critical infrastructure. Flexxon specializes in providing reliable storage components for sectors such as automotive, medical, and industrial automation.

Memory IC Replacement Considerations

Check for direct substitutes within the same XTRA III series, such as different capacity variants like FEMC002GTTE7-T14-17, ensuring package and electrical specifications match. Verify cross-compatibility with other eMMC 4.5 controllers before substitution.

FEMC004GTTE7-T13-18FEMC004GTTE7-T13-18
$11.93
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