FEMC004GTTE7-T14-16

Memory IC Overview

The FEMC004GTTE7-T14-16 is a 32Gbit (4GB) embedded multimedia card (eMMC) flash memory integrated circuit manufactured by Flexxon Pte Ltd. It utilizes MLC NAND technology with a 4G x 8 memory organization. The device operates within a supply voltage range of 2.7V to 3.6V and supports clock frequencies up to 200 MHz. Designed for industrial environments, it features an operating temperature range of -40°C to 85°C. The component is housed in a 153-ball Fine-Pitch Ball Grid Array (FBGA) package suitable for surface mount assembly.

Memory IC Feature Summary

• High-density eMMC storage solution utilizing MLC NAND technology
• Industrial-grade wide operating temperature range for harsh environments
• Supports high-speed data transfer via eMMC interface
• Robust surface mount packaging for reliable integration

Memory IC Applications

• Industrial control systems
• Automotive electronics
• Embedded computing devices
• Consumer electronics requiring durable storage

Memory IC Procurement Notes

Verify the specific package variant, as Flexxon offers this capacity in different ball counts such as 100FBGA or 153FBGA. Confirm that the required thermal rating matches the -40°C to 85°C specification. Ensure compatibility with the host controller's eMMC version support before procurement.

Memory IC Selection Notes

Select this component when a 4GB capacity is required for embedded applications. Consider the 153FBGA package size against board space constraints. Verify that the host system supports the 2.7V-3.6V voltage range and that the industrial temperature rating meets environmental requirements.

Memory IC Part Context

This part belongs to Flexxon's FEMC series of embedded flash memory solutions. The series provides various capacities and package options tailored for industrial and automotive markets. The T14 suffix typically denotes the specific package type and pin configuration used in this model.

Memory IC Replacement Considerations

The FEMC004GTTE7-T13-17 is a comparable alternative offering the same 32Gbit capacity but utilizes a 100FBGA package instead of the 153FBGA. Verify pinout compatibility and physical footprint differences before substitution.