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FEMC004GTTG7-T13-16 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 32GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.
The Flexxon FEMC004GTTG7-T13-16 is a NAND Flash memory IC based on the eMMC standard. It features a 32Gbit capacity and utilizes MLC technology. The device operates at a clock frequency of 200 MHz and is housed in a 100-FBGA package with dimensions of 14x18 mm. It supports an operating temperature range from -40°C to +85°C, ensuring reliability in industrial environments.
Verify the specific suffix T13-16 against official Flexxon documentation to confirm pinout and electrical characteristics. Ensure compatibility with host controllers supporting eMMC 5.1 or 4.x standards. Request manufacturer datasheets to validate the -40°C to +85°C industrial temperature rating and hardware encryption implementation details before integration.
Select this component when industrial-grade reliability and wide temperature operation are required. The 100-FBGA package suits space-constrained designs. Verify that the host system supports the 200 MHz interface speed and that software-based write protection meets the application's security requirements without additional hardware overhead.
This part belongs to the Flexxon XTRA III series of eMMC solutions. The series targets applications demanding high performance and robustness in harsh conditions. It integrates advanced power management and error correction mechanisms typical of industrial-grade flash memory products designed for critical data retention.
Check for direct substitutes within the same Flexxon family, such as variants with different suffixes indicating package or temperature changes. Ensure any replacement maintains the 100-FBGA footprint and 32Gbit capacity. Verify interface compatibility with existing eMMC controllers.
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