Memory IC FEMC004GTTG7-T13-16 product image

FEMC004GTTG7-T13-16

$11.65
  • Description:IC FLASH 32GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:a0fe3fa3bc7d Category: Brand:

  
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FEMC004GTTG7-T13-16 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 32GBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC004GTTG7-T13-16

  • Description:IC FLASH 32GBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:32Gbit
  • Memory Organization:4G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC004GTTG7-T13-16

FEMC004GTTG7-T13-16

Memory IC Overview

The Flexxon FEMC004GTTG7-T13-16 is a NAND Flash memory IC based on the eMMC standard. It features a 32Gbit capacity and utilizes MLC technology. The device operates at a clock frequency of 200 MHz and is housed in a 100-FBGA package with dimensions of 14x18 mm. It supports an operating temperature range from -40°C to +85°C, ensuring reliability in industrial environments.

Memory IC Feature Summary

  • Hardware encryption function for data security
  • ECC error correction capability
  • Software write protection support

Memory IC Applications

  • Industrial embedded systems
  • Automotive electronics
  • High-reliability data storage devices

Memory IC Procurement Notes

Verify the specific suffix T13-16 against official Flexxon documentation to confirm pinout and electrical characteristics. Ensure compatibility with host controllers supporting eMMC 5.1 or 4.x standards. Request manufacturer datasheets to validate the -40°C to +85°C industrial temperature rating and hardware encryption implementation details before integration.

Memory IC Selection Notes

Select this component when industrial-grade reliability and wide temperature operation are required. The 100-FBGA package suits space-constrained designs. Verify that the host system supports the 200 MHz interface speed and that software-based write protection meets the application's security requirements without additional hardware overhead.

Memory IC Part Context

This part belongs to the Flexxon XTRA III series of eMMC solutions. The series targets applications demanding high performance and robustness in harsh conditions. It integrates advanced power management and error correction mechanisms typical of industrial-grade flash memory products designed for critical data retention.

Memory IC Replacement Considerations

Check for direct substitutes within the same Flexxon family, such as variants with different suffixes indicating package or temperature changes. Ensure any replacement maintains the 100-FBGA footprint and 32Gbit capacity. Verify interface compatibility with existing eMMC controllers.

FEMC004GTTG7-T13-16FEMC004GTTG7-T13-16
$11.65
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