FEMC004GTTG7-T24-16

Memory IC Overview

The FEMC004GTTG7-T24-16 is a non-volatile memory IC manufactured by Flexxon Pte Ltd, belonging to the XTRA III series. It features 32 Gbit NAND MLC flash storage in a 153-FBGA package measuring 11.5x13 mm. The component supports a clock frequency of 200 MHz and operates within an industrial temperature range of -25°C to 85°C.

Memory IC Feature Summary

• High-speed read/write capabilities enabled by a 200MHz clock frequency
• Reliable data retention provided by MLC NAND technology with integrated error correction

Memory IC Applications

• Embedded communication systems
• HMI and display projects with external peripherals

Memory IC Procurement Notes

Verify the specific operating temperature grade (-25°C to 85°C) against your system requirements, as this differs from standard commercial ranges. Confirm the 153-FBGA footprint dimensions (11.5x13 mm) match your PCB layout. Ensure compatibility with the XTRA III series controller logic for proper integration.

Memory IC Selection Notes

Select this component when industrial-grade thermal stability is required alongside high-density storage. The 32 Gbit capacity suits applications needing robust data retention without external power. The eMMC interface simplifies host controller integration compared to raw NAND solutions.

Memory IC Part Context

This part is part of Flexxon's XTRA III series, designed for embedded multimedia card applications. It utilizes MLC NAND technology to balance cost and endurance. The 153-FBGA package allows for compact board designs while maintaining electrical performance at 200 MHz.

Memory IC Replacement Considerations

Check for exact pinout compatibility with existing 153-FBGA footprints. Verify that substitute parts support the same 200 MHz clock speed and -25°C to 85°C temperature range to ensure functional equivalence in industrial environments.