FEMC008G-M10

Memory IC Overview

The FEMC008G-M10 is an 8GB MLC NAND flash memory component belonging to the ECON II series. It complies with the JEDEC eMMC 5.1 standard and utilizes a 153-ball FBGA package measuring 11.5x13 mm. The device operates within a supply voltage range of 2.7V to 3.6V and supports clock frequencies up to 200 MHz. It is designed for surface mount applications and functions reliably across an operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Complies with JEDEC eMMC 5.1 standards
• Integrates embedded flash with controller
• Supports advanced power management
• Optimized for low-power electronic devices

Memory IC Applications

• Small electronic devices
• Low-power consumer electronics
• Embedded storage systems

Memory IC Procurement Notes

Verify the specific package dimensions and pinout configuration against the official datasheet before integration. Confirm that the selected variant meets the required industrial temperature specifications for your target environment. Ensure compatibility with the host controller's eMMC interface version. Check for RoHS compliance status if environmental regulations apply to your manufacturing process.

Memory IC Selection Notes

Select this component when a compact, high-reliability storage solution is required for space-constrained designs. The MLC technology offers a balance between endurance and cost-effectiveness compared to SLC alternatives. Consider the 153-ball FBGA footprint during PCB layout planning. Evaluate power consumption requirements to ensure the 2.7V-3.6V supply range aligns with the system architecture.

Memory IC Part Context

This part belongs to Flexxon's ECON II series, which focuses on providing robust embedded multimedia card solutions. The series targets applications requiring dependable data retention in challenging environments. Flexxon specializes in industrial-grade memory products designed for longevity and stability. This specific model represents a mid-range capacity option within their broader portfolio of embedded flash memories.

Memory IC Replacement Considerations

Direct substitutes must match the 153-ball FBGA package and eMMC 5.1 interface. Verify that alternative components support the same 8GB capacity and MLC technology. Ensure compatible voltage ranges and operating temperature limits are maintained. Cross-reference pin assignments to guarantee mechanical and electrical interchangeability without redesigning the host board.