FEMC008GBG-T340

$11.30

Description：IC FLASH 64GBIT EMMC 153FBGA
Series：XTRA V
Mfr：Flexxon Pte Ltd
Package：Tray

SKU:a8afc82f548c Category: Memory IC Brand: Flexxon Pte Ltd

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Product introduction

FEMC008GBG-T340 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GBG-T340

Description：IC FLASH 64GBIT EMMC 153FBGA
Series：XTRA V
Mfr：Flexxon Pte Ltd
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (TLC)
Memory Size：64Gbit
Memory Organization：8G x 8
Memory Interface：eMMC
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-25°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：153-VFBGA
Supplier Device Package：153-FBGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for FEMC008GBG-T340

FEMC008GBG-T340

Memory IC Overview

The FEMC008GBG-T340 is a 64 Gbit (8 GB) NAND flash memory IC manufactured by Flexxon Pte Ltd. It utilizes TLC technology and supports the eMMC interface with a clock frequency of 200 MHz. The device is organized as 8G x 8 bits and is housed in a 153-FBGA package measuring 11.5x13 mm. It belongs to the XTRA V series, designed for industrial-grade non-volatile storage applications requiring reliable data retention.

Memory IC Feature Summary

Supports eMMC interface protocol for standardized connectivity
Utilizes TLC NAND technology for high-density storage
Operates at a clock frequency of 200 MHz
Packaged in a compact 153-FBGA form factor

Memory IC Applications

Industrial embedded systems
Medical device data logging
Automotive infotainment units

Memory IC Procurement Notes

Verify the specific suffix against official Flexxon documentation to confirm exact electrical characteristics and temperature ranges. Ensure compatibility with host controller eMMC versions before integration. Cross-reference package dimensions and pinout configurations with the official datasheet to prevent mechanical interference during PCB layout and assembly processes.

Memory IC Selection Notes

Select this component when an eMMC interface is required for system integration. Consider the 200 MHz clock speed for bandwidth requirements. Evaluate the 153-FBGA package size constraints against available board space. Confirm that the TLC technology meets endurance expectations for the intended write cycle lifespan in the target application environment.

Memory IC Part Context

Flexxon specializes in industrial NAND flash storage solutions for demanding sectors including medical and automotive industries. The XTRA V series represents their line of robust memory devices engineered for extended operational lifespans and reliability under harsh environmental conditions compared to consumer-grade alternatives.