Memory IC FEMC008GME-E340 product image

FEMC008GME-E340

$11.93
  • Description:IC FLASH 64GBIT EMMC 153FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:cb7dfa0de88a Category: Brand:

  
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FEMC008GME-E340 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GME-E340

  • Description:IC FLASH 64GBIT EMMC 153FBGA
  • Series:AXO
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC008GME-E340

FEMC008GME-E340

Memory IC Overview

The FEMC008GME-E340 is an 8GB (64Gbit) eMMC 5.1 NAND flash memory component manufactured by Flexxon Pte Ltd. It utilizes Multi-Level Cell (MLC) technology and operates at a clock frequency of 200 MHz. The device features an 8G x 8 bit memory organization and supports a supply voltage range of 2.7V to 3.6V. It is housed in a 153-ball FBGA package with dimensions of 11.5x13 mm, designed for embedded applications requiring data integrity and cybersecurity.

Memory IC Feature Summary

  • eMMC 5.1 interface compliance for standardized embedded connectivity
  • MLC NAND architecture supporting high data density
  • Integrated cybersecurity and data confidentiality maintenance

Memory IC Applications

  • Embedded communication systems
  • AI-enabled cybersecurity solutions
  • High-speed data handling devices

Memory IC Procurement Notes

Verify the specific ordering suffix E340 against official Flexxon documentation to confirm pinout and thermal specifications. Ensure compatibility with host controllers supporting eMMC 5.1 standards. Confirm that the 153-FBGA footprint matches the target PCB design constraints before finalizing procurement orders.

Memory IC Selection Notes

Select this component when an 8GB capacity with MLC endurance characteristics is required for embedded environments. The 200 MHz clock speed suits applications needing moderate-to-high throughput. Verify that the system power supply remains within the 2.7V to 3.6V operating range to ensure stable performance.

Memory IC Part Context

This part belongs to the Flexxon AXO Series, which emphasizes Diamond Grade reliability. The series targets industrial and commercial embedded markets where data integrity and long-term retention are critical. The eMMC 5.1 standard ensures broad interoperability with modern embedded processors.

Memory IC Replacement Considerations

Cross-reference with other Flexxon eMMC 5.1 parts in the 153-FBGA package. Verify pin-to-pin compatibility if substituting with different density variants from the same manufacturer family.

FEMC008GME-E340FEMC008GME-E340
$11.93
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