Memory IC FEMC008GSTE9-T13-16 product image

FEMC008GSTE9-T13-16

$18.07
  • Description:IC FLASH 64MBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:9c92c5ba4eb2 Category: Brand:

  
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FEMC008GSTE9-T13-16 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64MBIT EMMC 100FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GSTE9-T13-16

  • Description:IC FLASH 64MBIT EMMC 100FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FBGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC008GSTE9-T13-16

FEMC008GSTE9-T13-16

Memory IC Overview

The FEMC008GSTE9-T13-16 is an industrial-grade non-volatile flash memory device belonging to the XTRA III series, manufactured by Flexxon Pte Ltd. It utilizes MLC NAND technology with a memory organization of 8G x 8 bits and supports the eMMC 5.1 interface standard. The component operates with a clock frequency of 200 MHz and requires a supply voltage ranging from 2.7V to 3.6V. Designed for robust performance in demanding environments, it features hardware-based cybersecurity solutions and high endurance capabilities suitable for critical data storage applications.

Memory IC Feature Summary

  • Complies fully with JEDEC eMMC 5.1 standards for reliable industrial communication
  • Integrates hardware-level cybersecurity protections to safeguard critical data integrity
  • Engineered for high endurance and stability within harsh operational environments

Memory IC Applications

  • Industrial automation systems requiring rugged storage
  • Medical devices needing secure and reliable data retention
  • Automotive electronics demanding high-performance memory
  • Telecommunications infrastructure equipment

Memory IC Procurement Notes

Verify that the specific part number matches the required XTRA III series specifications. Confirm compatibility with the target system's eMMC controller and voltage requirements before procurement. Ensure the supplier provides authentic components from Flexxon Pte Ltd or authorized channels to guarantee the integrity of the hardware security features and industrial-grade quality standards.

Memory IC Selection Notes

Select this component when JEDEC eMMC 5.1 compliance is mandatory for the design. Choose this model for applications requiring integrated hardware security alongside high endurance MLC NAND performance. Consider the 200 MHz clock speed and 2.7V to 3.6V operating range to ensure alignment with the host system's power and interface constraints.

Memory IC Part Context

This part belongs to the XTRA III series of industrial NAND flash storage devices produced by Flexxon Pte Ltd. The manufacturer specializes in hardware-based cybersecurity solutions and rugged storage for critical industries. This series is designed to meet stringent reliability standards, offering enhanced protection against data corruption and unauthorized access compared to standard commercial-grade memory.

Memory IC Replacement Considerations

Ensure any substitute maintains eMMC 5.1 compatibility and similar voltage ranges. Verify that alternative parts offer comparable industrial-grade endurance and security features if these are critical to the application.

FEMC008GSTE9-T13-16FEMC008GSTE9-T13-16
$18.07
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