Memory IC FEMC008GSTE9-T14-16 product image

FEMC008GSTE9-T14-16

$9.38
  • Description:IC FLASH 64MBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray

SKU:83129b8b9cc5 Category: Brand:

  
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FEMC008GSTE9-T14-16 is listed in the Memory IC range at ChipApex. The manufacturer field lists Flexxon Pte Ltd. Its product description is IC FLASH 64MBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for FEMC008GSTE9-T14-16

  • Description:IC FLASH 64MBIT EMMC 153FBGA
  • Series:XTRA III
  • Mfr:Flexxon Pte Ltd
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC_5.1
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:153-VFBGA
  • Supplier Device Package:153-FBGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for FEMC008GSTE9-T14-16

FEMC008GSTE9-T14-16

Memory IC Overview

The FEMC008GSTE9-T14-16 is an embedded MultiMediaCard (eMMC) flash memory device from Flexxon, compliant with the JEDEC eMMC 5.1 standard. It features a 64 Gbit (8 GB) MLC NAND capacity organized as 8G x 8-bit. The component operates within a supply voltage range of 2.7V to 3.6V and supports a clock frequency of up to 200 MHz. Designed for industrial applications, it functions reliably across a temperature range of -40°C to 85°C (TA). The device utilizes a 153-pin VFBGA surface-mount package.

Memory IC Feature Summary

  • Complies with JEDEC eMMC 5.1 standard specifications
  • Utilizes MLC NAND technology for enhanced endurance
  • Supports high-speed data transfer via 200 MHz clock frequency
  • Engineered for stable operation in extended industrial temperature ranges

Memory IC Applications

  • Industrial control systems requiring robust storage
  • Medical devices needing reliable embedded memory
  • Automotive electronics operating in harsh environments

Memory IC Procurement Notes

Verify component authenticity through authorized channels, as this part may be discontinued at certain distributors. Confirm exact ordering suffixes match required specifications. Check current availability status before finalizing procurement plans due to potential supply chain constraints for legacy or specialized industrial components.

Memory IC Selection Notes

Select this model when JEDEC eMMC 5.1 compatibility is mandatory. Ensure system power supplies support the 2.7V to 3.6V input range. Verify PCB layout accommodates the 153-VFBGA package dimensions. Consider thermal management requirements for operations near the upper 85°C limit.

Memory IC Part Context

This component belongs to Flexxon's XTRA III series, which focuses on industrial-grade NAND flash solutions. The series targets sectors demanding high reliability, such as medical and automotive fields. It integrates controller and NAND flash into a single package for simplified design integration.

Memory IC Replacement Considerations

Direct substitutes must match the 153-VFBGA package and eMMC 5.1 interface. Verify capacity and voltage compatibility. Cross-reference with other Flexxon industrial eMMC models if available.

FEMC008GSTE9-T14-16FEMC008GSTE9-T14-16
$9.38
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